We search for industry news, so you don't need to.   White Paper: Photo Resist coating Precision coating with Ultraspray Technology Outlines coating methods for the precise deposition of photo resist to wafers where traditional spin coating technology has proven ineffective such as coating wafers with micro-vias and non-traditional wafer designs. Click here to download paper… Ultrasonic Systems, Inc. Home  I  Site Map  I  News  I  Corporate News  I  Exclusives  I  Calendar  I  White Papers Desire for Two in One? Datacon Multi-Chip Die Bonder2200 evo! Dispenser, die attach unit and flip chip unit in one module! An accuracy of10µm@3s at highest through-put of up to 7,000 UPH! 2200 evo: ultimate flexibility and best cost of ownership. Learn more… Datacon Technology GmbH Improved Accuracy & Repeatability for the Dispensing Process GPD Global's backlit calibration station improves accuracy and repeatability in dispensing. Alignment of the dispense tip is enhanced by illuminating material dispensed during calibration from below, eliminating sheen from fluid droplets that cause errors in traditional vision alignment. Learn more … GPD Global Letters to the Editor    Page 1 of 2   Comments and opinions from our readers. Submit a Letter to the Editor July 18, 2008 Semi Announces That Attendance is Down I was involved in a co-located conference with Semicon West for a number of years, starting out when they had ... Tom, Package Science Services   February 4, 2008 Graphene Transistors Why does nanotech have an identity crisis? Aside from not clearly defining itself (and not differentiating from nano-scale - that is ... Ken Gilleo, ET-Trends LLC   September 18, 2007 Looks Like Solar is Here to Stay Being a permanent reader of the circuitnet newsletter, I was hoping to find a more researched article ... Markus Wilkens, ASYS Inc.   August 22, 2007 We need a new Mantra This article reminds me of a thought I had several days ago while reading about ... Mary Hubbard   August 20, 2007 We need a new Mantra Like the ancient Greek PLENIDES, you have chosen a holy cow to slaughter!!! I would suggest ... Joe Battaglia, TeemPhotonics   August 20, 2007 We need a new mantra Good article - this is the kind of thinking the industry needs. As we go forward, growth seems ... Bob Johnson, Gartner   July 10, 2007 From the Editor's Desk Steve, congratualtions. I look forward to reading your industry updates. Dan Feinberg, Fein-Line Associates, Inc.   July 3, 2007 Welcome Steve DeCollibus Congratulations Steve, Looking forward to working with ... Megan Wendling, MW Associates   July 2, 2007 Welcome Steve DeCollibus Steve, it is just grand to see your cheerful face lighting up the ... Ken Gilleo, ET-Trends   June 28, 2007 Welcome Steve DeCollibus Congratulations, Steve. I'm sure you will do a great job. This ... Mitch Holtzer, Global Product Manager, Cookson Electronics   Letters to the Editor    Page 1 of 2   Die attach and flip chip placement The Juki CX Series The CX-1 is a next-generation advanced placement machine capable of handling a wide range of components for semiconductor packaging. The CX Series delivers the lowest cost of ownership for greater value and flexibility. Learn Why... Juki Corporation Home  |   About Us  |   Advertising  |   Advertising Rates  |   Archives  |   Calendar  |   Corporate News Contact Us  |   Free Subscription  |   Industry News  |   Exclusives  |   Letters  |   Viewpoint  |   White Papers Search Category    Entire Site Industry/Technology News Corporate News Exclusive Articles Event Calendar White Papers Issue Archives Company Information    Search Term    To search a phrase, place it in quotes. Semiconductor Packaging News - A Circuitnet Publication We search for industry news so you don't need to. Circuitnet LLC, 135 Ward Hill Avenue, Haverhill, MA 01835 USA Copyright © 2008 Circuitnet.    All rights reserved. Jeff Ferry, Publisher  | Ken Cavallaro, Business Manager Visit Circuitnet for the latest electronics assembly news and information.