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Feb 2, 2012
Lessons Learned from 3D DRAM-on-Logic Chip Development
Three-dimensional (3D) integration is considered a very promising technology for integrated circuit design. It provides numerous opportunities to designers looking for more cost-effective system chip solutions. It allows further decreasing the form factor of today's systems and eases the interconnect performance limitation. And it makes it possible to ...
Eric Beyne
imec
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Jan 30, 2012
2012 IC Market Forecast
We were invited to attend an IC Insights seminar on the "The McClean Report" last week in Boston. The seminar was hosted by Bill McClean and Trevor Yancey for IC Insights and provided an excellent update on the semiconductor markets for 2012. The presentation included over 100 slides with analysis and forecast for the IC industry. I've summarized the highlights ...
Ken Cavallaro
Semiconductor Packagning News
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Oct 31, 2011
Moving On
Someone once said, "All changes are more or less tinged with melancholy, for what we are leaving behind is part of ourselves." And that is kind of how I feel today searching through the web to find the last batch of breaking news stories for Circuitnet and Semiconductor Packaging News.
Steve DeCollibus
Semiconductor Packaging News
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Oct 13, 2011
International Symposium on Microelectronics
We attended the 44th annual International Symposium on Microelectronics this week at the Long Beach Convention Center in California. The conference brings together microelectronics industry's suppliers and users addressing all aspects of microelectronics. Registered attendance was up slightly from last year and ...
Ken Cavallaro
Semiconductor Pakaging News
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Oct 11, 2011
IMEC Technology Forum, Leuven, Belgium
If the Electronics Industry news seems a little short this week, it may be because forty or so of the key industry observers find themselves at the Imec Annual Technology Forum in Leuven, Belgium this week. The forum has become an important stop for their quest to learn what the future holds ...
Steve DeCollibus
Semiconductor Pakaging News
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Oct 6, 2011
Wafer Level Packaging Conference
The International Wafer Level Packaging Conference (IWLPC) was held yesterday and today at the Marriott in Santa Clara, CA. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging. Registered attendance was up 30% from ...
Ken Cavallaro
Semiconductor Packagning News
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Sep 22, 2011
Advanced Packaging Conference at SEMICON Europa 2011
SEMICON Europa is the largest industry event in Europe focused on technologies and solutions for advanced microelectronics manufacturing. The topics covered are related to semiconductors, MEMS, printed and plastic electronics, power electronics, and other emerging ...
Andy Longford
SEMI
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Jul 14, 2011
Semicon West 2011
The Semicon West show in San Francisco has been a busy event. Each morning as the show opens at 10:00 AM, there is a line of visitors waiting to enter the halls as show management claims 10,000 visitors registered for the event. This is a good sign for an industry which can be so cyclical with feast and famine years ...
Ken Cavallaro
Semiconductor Packaging News
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Jun 7, 2011
How Should American Tech Firms Proceed in Japan
In our previous article, Japanese Technology Markets Still Beckon and Confound, written just prior to the recent calamities, we said that the Japanese market currently offers great and accessible opportunities to small and medium-sized American technology firms ...
Nobuyuki Imamura, Larry Timm
Japan Marketing Office
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Mar 31, 2011
Japanese Technology Markets Still Beckon and Confound
Twenty years ago the Japanese market commanded every technology executive's attention. Japanese firms had grown enormously powerful in the US and other international markets, while US companies struggled to understand the basics of entry into the Asian giant's corporate procurement culture. Libraries were written and courses were ...
Nobuyuki Imamura and Larry Timm
Japan Marketing Office
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