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  Micro Dispensing Technology
Technical white paper
imageThe trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size. These requirements often call for tiny dot sizes of paste, epoxy & conductive adhesives. Learn more from this paper…
DL Technology
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Webcast: Silicon Interposers with
TSVs and Thin-Film Capacitors
First Through-Silicon Via FoundryThe evolution of silicon interposers without Through Silicon Vias (TSVs) to interposers with TSVs. Webcast on March 17, will discuss mechanical benefits of attaching ICs to silicon and electrical benefits of passive and active elements including Implementation & reliability data. Learn more…
ALLVIA, Inc.




NEW Hesse & Knipps BONDJET BJ915L
for your leadframe applications
Bond Jet BJ920Hesse & Knipps BONDJET BJ915L heavy wire bonder gives you high speed leadframe production with dual heads, award-winning PiQC and inline shear and pull test. Learn more…
Hesse & Knipps
Announcements/Exclusive Articles    Page 1 of 29  
Mar 9, 2010
iMAPS Global Business Council
imageWe were invited to attend the 2010 Spring Conference of the iMAPS Global Business Council yesterday at the Radisson Fort McDowell in Scottsdale, AZ in conjunction with Device Packaging 2010. We listened to many speakers and the presenters were very upbeat, which is interesting as exactly 12 months ago, the market was hitting all time lows. While the focus of IMAPS ...
Ken Cavallaro
Semiconductor Packaging News
Mar 3, 2010
Presto Engineering CEO Michel Villemain Interview
imageA recent press release from Presto Engineering identifying them as, "the pioneers of the 'Labless' business model for bringing semiconductor products into volume production" caught my eye. In order to get a better idea of what the 'Labless' concept entailed we asked their CEO Michel Villemain to share some of his ideas with us. Explain for our ...
Steve DeCollibus
Semiconductor Packaging News
Feb 16, 2010
Gold vs. Copper, Let the Debate Begin
imageSemi recently announced the results of a study conducted by the World Gold Council. The study was conducted in order to to determine the extent of copper bonding wire programs in the industry and to identify the key issues and considerations related to decisions in selecting bonding wire material. Companies surveyed included both integrated device manufacturers (IDMs) and fabless ...
Steve DeCollibus
Semiconductor Packaging News
Feb 11, 2010
Why the Future of Reliability in Electronic Products Matters
imageOne of the hallmarks of electronics manufacturing over the course of its history has been its relentless pursuit of making each new generation of products ever smaller while simultaneously increasing their performance. The reliability of those products was for many years, unquestioned and was the cornerstone of the industry's success. However, over the last decade or so, the electronics ...
Joe Fjelstad
Verdant Electronics
Feb 2, 2010
Semi-Industry Shows Signs of Life
imageWhile most of the media focused on the launch of the Apple iPad last week we attended Bill McClean's annual McClean Report seminar in Boston. For me this seminar has become an annual preview on the state of the semiconductor industry. I like his analysis as Bill is a cup half-full kind of person and we need more of them in the industry these day's, and he has been correct more often ...
Steve DeCollibus
Semiconductor Packaging News
Announcements/Exclusive Articles    Page 1 of 29  


Does your vapor phase reflow
offer guarantees? Ours Does
ATEK Reflow• Oxygen Free Process. • Zero deg Delta T at Peak temperature. • Not to exceed Max temp for all components. • Programmable ramp rates between 1-4 deg c/sec. Click here to learn more…
ATEK Systems Group




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