Jul 15, 2010 Momentum Continues Semicon West was busy on Wednesday with thousands of attendees visiting exhibitors booths for demonstrations of the newest technology. The crowded exhibit floor made it difficult to meet with company management as they were busy talking to visitors, which is the goal of a good ... Ken Cavallaro Semiconductor Packaging News
Jul 14, 2010 What a Difference a Year Makes Before the opening of Semicon West, we attended an analyst meeting hosted by Applied Materials with 200 other industry experts. Mike Splinter, CEO said it was the first time in years they could smile at Semicon. Business at AMAT was very strong with 10 new products released over the past year, and wafer fab at full capacity. He commented that revenue will grow over ... Ken Cavallaro Semiconductor Packaging News
Jun 8, 2010 An Ultralow-Power Radio Receiver Module: Key Issues and Use Cases How to make a radio receiver that meets the challenges of future autonomous sensor systems, i.e., ultralow-power consumption (50µW) and high sensitivity? A feasible solution is to use an energy-friendly envelope detector and to reduce the receiver noise by applying a double-sampling technique. When using this approach sensitive receiver modules with power consumption as low as 51µW ... imec and Holst Centre imec and Holst Centre
Mar 10, 2010 iMAPS device packaging conference The iMAPS device packaging conference continued yesterday in Scottsdale, AZ with technical presentations and exhibitor displays. About 500 industry professionals attended the "Device Packaging Conference" and were prepared for dozens of technical sessions on 3D packaging, MEMS and Wafer Level Packaging. One of the presentations was from Rich Rice, senior vice president of sales, North America from ASE Group. Rich spoke about their business of subcontracting ... Ken Cavallaro Semiconductor Packaging News
Mar 9, 2010 iMAPS Global Business Council We were invited to attend the 2010 Spring Conference of the iMAPS Global Business Council yesterday at the Radisson Fort McDowell in Scottsdale, AZ in conjunction with Device Packaging 2010. We listened to many speakers and the presenters were very upbeat, which is interesting as exactly 12 months ago, the market was hitting all time lows. While the focus of IMAPS ... Ken Cavallaro Semiconductor Packaging News
Semicon West was busy on Wednesday with thousands of attendees visiting exhibitors booths for demonstrations of the newest technology. The crowded exhibit floor made it difficult to meet with company management as they were busy talking to visitors, which is the goal of a good ...
Before the opening of Semicon West, we attended an analyst meeting hosted by Applied Materials with 200 other industry experts. Mike Splinter, CEO said it was the first time in years they could smile at Semicon. Business at AMAT was very strong with 10 new products released over the past year, and wafer fab at full capacity. He commented that revenue will grow over ...
The iMAPS device packaging conference continued yesterday in Scottsdale, AZ with technical presentations and exhibitor displays. About 500 industry professionals attended the "Device Packaging Conference" and were prepared for dozens of technical sessions on 3D packaging, MEMS and Wafer Level Packaging. One of the presentations was from Rich Rice, senior vice president of sales, North America from ASE Group. Rich spoke about their business of subcontracting ...
We were invited to attend the 2010 Spring Conference of the iMAPS Global Business Council yesterday at the Radisson Fort McDowell in Scottsdale, AZ in conjunction with Device Packaging 2010. We listened to many speakers and the presenters were very upbeat, which is interesting as exactly 12 months ago, the market was hitting all time lows. While the focus of IMAPS ...
