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  White Paper: Photo Resist coating
Precision coating with Ultraspray Technology
imageOutlines coating methods for the precise deposition of photo resist to wafers where traditional spin coating technology has proven ineffective such as coating wafers with micro-vias and non-traditional wafer designs. Click here to download paper…
Ultrasonic Systems, Inc. Advertisement
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Bringing the Best Together
Ablestik & Emerson Cuming's join Henkel
imageHenkel brings the best electronics and semiconductor material brands together for long-term solutions. Our wide range of Electronics Assembly products including Loctite, Multicore, Hysol, Ablestik and Emerson Cuming will deliver results for your production requirements. Learn more …
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Asymtek's SV-100 Slider Valve
Faster Solder Paste Dispensing
imageUp to 20% faster than standard auger dispensers, the SV-100 achieves 20,000, 300 micron dots per hour and can selectively dispense into small and hard to reach places where it is difficult to screen print. See more…
Asymtek Advertisement
Announcements/Exclusive Articles    Page 1 of 14  
Jul 18, 2008
Final Day
imageToday the show closes. A few things I will remember about this week will be the incredible blues band playing outside the North and West halls, the weather, which has been spectacular and unfortunately what appeared to be the doubling of the homeless community in the last year. The show itself I will remember and mark as the year packaging ...
Steve DeCollibus

Jul 17, 2008
Semi Announces That Attendance is Down
imageThe attendance had appeared light at the SEMICON West show and was confirmed yesterday when SEMI announced that indeed it had dropped 25% the first day. Numbers have not been announced for Tuesday. The mood here remains up beat and the people who have come, seem to be having a good show, with many booking new ...
Steve DeCollibus
Semiconductor Packaging News
Jul 16, 2008
Opening Day
imageThe show opening today was overshadowed by SEMI’s announcement yesterday that they anticipate that global semiconductor equipment sales will fall 20 % in 2008. The companies we spent time with yesterday seemed to contradict that announcement, they all shared very positive sales so far in 2008, while many were ...
Steve DeCollibus
Semiconductor Packaging News
Jul 15, 2008
New Enabling Micro and NanoMetallization Process Shows Promise
imageECPR™ (ElectroChemical Pattern Replication) is a technology most of us haven’t heard of, yet it may well prove to be the enabling technology of choice for fabrication of micro- and nano-scale metal layers, and a process that when launched will give manufacturers of advanced packaging, substrates, ...
Steve DeCollibus

Jul 14, 2008
SEMICON West 2008
imageSEMICON West 2008
As we prepare to leave for an intense week of meetings and presentations at SEMICON West, I am thinking about a few things. First, this is my ...

Steve DeCollibus
Semicondcutor Packaging News
Announcements/Exclusive Articles    Page 1 of 14  


An AOI that finds all defects
Improve quality and yield of production
imageTechnology for inspecting includes: Thickfilm, Thinfilm, LTCC, Adhesive, Overglaze, Solar Cells, Gold (Printed, plated), All printed or electroplated Layers. Learn more by clicking …
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