Semiconductor Packaging News
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Feb 3, 2014
2014 IC Market Forecast
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Semiconductor Packaging News attended an IC Insights seminar last week in Boston, and the meeting was upbeat. The seminar was hosted by Bill McClean of IC Insights who provided predictions on the semiconductor markets for 2014. The presentation focused on data from the McClean Report including analysis and forecasts for the IC industry. Bill's forecast...
Ken Cavallaro Semiconductor Packaging News
Dec 19, 2013
2014 IPC Electronic System Technologies Conference
Based on a spectacular inaugural event in May 2013, the Electronic System Technologies Conference and Exhibition is seeking abstracts, course proposals and exhibitors for the 2014 event which will take place again at the New Tropicana on May 20-22, 2014. Organized by IPC, and supported by other organizations such ...
Electronic System Technologies Conference Conference IPC
Sep 4, 2013
Transistor Scaling: What is Ahead of Us?
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At the imec technology forum in San Francisco, senior vice president process technology An Steegen discussed the roadmap that research centre imec and its partners are pursuing to keep up with Moore's law. Learn all about metal gate stacks, FinFETs, gate-all-around nanowires and quantum devices.
An Steegen Imec
Apr 24, 2013
IPC ESTC Presenting the Titans of the Industry
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The IPC Electronic System Technologies Conference and Exhibition (ESTC), which spans the entire spectrum of the electronics industry, will be held at the New Tropicana, Las Vegas, Nevada, May 20-23, 2013. Click this link "www.ipc.org/estc" to view the industry speakers and companies coming together at this inaugural event. The electronics industry is not ...
ESTC Conference IPC
Feb 1, 2013
2013 IC Market Forecast
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Semiconductor Packaging News attended an IC Insights seminar featuring the "The McClean Report" this week in Boston. The seminar was hosted by Bill McClean of IC Insights and provided updates on the semiconductor markets for 2013. The presentation included analysis and forecasts for the IC industry with over 100 slides. This report gathers data from the ...
Ken Cavallaro Semiconductor Packaging News
Jan 15, 2013
Next Steps in Low Alpha Material Technology
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Alpha emissions from IC packaging materials have become a greater concern as device geometries continue to decrease and design complexity increases. The trend towards flip chip and 3DIC architecture, in particular, has increased the need for reliable low alpha packaging materials. In these designs, packaging features such as wafer-level solder bumps and ...
Brett Clark Honeywell Electronics Materials
Nov 7, 2012
imec at ESTC2012
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In the past decade, interconnect and packaging technologies have become key enablers for advanced microelectronic systems. The world witnessed an amazing growth of smart phones and tablet devices, but also in other domains, microelectronic technologies are becoming ...
Eric Beyne, imec & Jan Vanfleteren, imec - UGent IMEC
Sep 17, 2012
IMAPS International Symposium on Microelectronics
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We attended the 45th International Symposium on Microelectronics last week in San Diego, California. The conference delivered a wide range of technical programs and exhibits for the microelectronics industry. The event included over 100 exhibitors who showcased ...
Ken Cavallaro Semiconductor Packaging News
Jul 12, 2012
Semicon West 2012
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The Semicon West show in San Francisco has been a busy conference with technical sessions on the latest technology in semiconductor design, manufacturing and packaging. Each morning thousands of visitors also wait for the exhibit halls to open to review the newest technology to increase ...
Ken Cavallaro Semiconductor Packaging News
Jun 21, 2012
3D-IC Progress on Display at SEMICON West 2012
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Given their potential for smaller form factors, increased performance, and reduced cost and power consumption, 3D-IC technologies are now enabling the next generation of advanced semiconductor packaging. Already, 2.5D technology using silicon interposers to provide wide IO bandwidth and denser packaging have ...
Denny McGuirk SEMI
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