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  Micro Dispensing Technology
Technical white paper
imageThe trend toward micro-dispensing technology increases as electronic assembly's shrink & component packages decrease in size. These requirements often call for tiny dot sizes of paste, epoxy & conductive adhesives. Learn more from this paper…
DL Technology
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F&K Delvotec introduces
World's ONLY Rotary Head Ball Bonder
Bonding & TestingF&K Delvotec continues our technology leadership with the New Model 62000-G5, worlds first & only Rotary Head Ball Bonder. Bonding the wire in-line with the ultrasonic motion can provide new stitch bonding solutions in demanding hybrid applications. Learn more…
F&K Delvotec




Jetting Systems Technology
New white paper
Dispensejet DJ-100 Jetting technology has become the preferred alternative to needle dispensing in many semiconductor packaging applications. Jetting allows designers to rewrite their design rules making smaller, less expensive, and more capable devices. Learn more…
Nordson ASYMTEK
Corporate News    Page 1 of 259  
Corporate news releases from manufacturers, supplies, and organizations supporting semiconductor packaging.

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Corporate News
Sep 2, 2010
Nordson ASYMTEK Introduces New Spectrum S-920N-C Stainless Steel Cleanroom Dispenser
Nordson ASYMTEK introduces its S-920N-C stainless steel dispensing system that is third-party certified for Class 100 cleanroom use. It is ...
Nordson ASYMTEK
Sep 2, 2010
Samsung Unveils 16GB 'Very Low Profile' Module in IBM's Blade Server
Samsung Electronics Co., Ltd. announced it will demonstrate for the first time a 16-Gigabyte (GB), very low profile (VLP) memory module at the ...
Samsung Electronics Co., Ltd.,
Sep 2, 2010
SUSS MicroTec Appoints New VP R&D
SUSS MicroTec has appointed Dr Rainer Knippelmeyer as Vice President R&D and CTO. In this function Reiner Knippelmeyer will oversee research ...
SUSS MicroTec
Sep 1, 2010
Moog Acquires isel Robotik USA, LLC
Moog Industrial Group has acquired Fremont, Calif.-based isel Robotik USA, LLC in order to add vacuum and atmospheric robots to Moog's wafer ...
Moog Industrial Group
Sep 1, 2010
AVX Expands MLCC Family to Include Gold Plated Terminations
AVX Corporation has expanded its extensive family of multilayer ceramic chips (MLCCs) to include gold plated terminations. Designated the Au ...
AVX Corporation
Sep 1, 2010
Microscreen Adds Second Exposure Room for Thick Film Screens
To accommodate the continued growth of our thick film screen business and to provide quick response to critical customer requirements, MicroScreen ...
Microscreen
Aug 31, 2010
Bentek Solar Launches Its CTO Solar Re-Combiner Configurator
Bentek Solar recently launched the new Bentek Solar Re-Combiner Configure-To-Order (CTO) Configurator. “The Bentek Solar CTO Re-Combiner ...
Bentek Solar
Aug 31, 2010
Samsung Showcasing Memory, Storage Server Solutions at VMworld
Samsung will exhibit leading memory and storage technologies for enterprises and small corporations in a 20,000 sq ft. booth, as well as ...
Samsung
Aug 31, 2010
ChipMOS Announces Changes to Its Board of Directors
ChipMOS TECHNOLOGIES LTD. announced that Mr. Rong Hsu, Mr. Cao Rong Tsai and Dr. John Yee Woon Seto have been elected as Board Directors to ...
ChipMOS
Aug 30, 2010
Join Amkor Technology, Inc. at Global Technology Conference
GLOBALFOUNDRIES will be hosting the first annual Global Technology Conference at the Santa Clara Convention Center. In addition to ...
Amkor Technology, Inc.
Corporate News    Page 1 of 259  


Metallization Lines by ASYS
Metallization LinesOver 8 GW installed
Lowest breakage rate in the industry, portfolio includes loading, unloading from stack or cassettes, inspection stations, printers, dryers, cooling units, laser edge isolation, buffers, cell testers & sorters. Visit us at Solar Power International, Booth # 421 or call us today at +1 866 GO 4 ASYS …
ASYS Group Americas Inc.




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