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Corporate news releases from manufacturers, supplies, and organizations supporting semiconductor packaging.
Submit Corporate News.
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Feb 3, 2012
Cree Releases Packaged 1700V SiC Schottky Diodes
Cree, Inc. has introduced a series of packaged diodes that deliver the industry’s highest blocking voltage available in SiC Schottky technology ...
Cree, Inc.
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Feb 3, 2012
Palomar Technologies Develops Wire-Bond-Free Direct Attach for LEDs
Palomar Technologies announced a precision eutectic process development for direct attach light emitting diodes (LEDs). "Direct-attach LEDs are the ...
Palomar Technologies, Inc.
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Feb 3, 2012
Multi-axes Cartesian Robotic Systems BSMA Series
IntelLiDrives Cartesian Multi-Axes Systems are built on BSMA Series motorized ball screw linear actuators and are ideal for many automation ...
IntelLiDrives
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Feb 2, 2012
Gore introduces first 20 nm PTFE/HDPE filter
W. L. Gore & Associates (Gore) has introduced the world's first 20 nm polytetrafluoroethylene (PTFE) filter in a high density polyethylene ...
W. L. Gore & Associates
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Feb 2, 2012
Pulse Electronics Nominated for Global Mobile Award
Pulse Electronics Corporation announces that it has been nominated for GSMA's 17th annual Global Mobile Awards 2012 in the Best Technology Breakthrough ...
Pulse Electronics Corporation
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Feb 1, 2012
Heraeus Announces New Name, Celcion(TM), and New Web Site for Its Insulated Aluminum Materials System
The Thick Film Division of Heraeus Precious Metals has announced a new name, Celcion(TM), for its Insulated Aluminum Materials System. A new Web site ...
Heraeus
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Feb 1, 2012
EDAX Launches New Team(TM) Pegasus Integrated EDS and EBSD System
EDAX Inc. has introduced the TEAM(TM) Pegasus system, which combines world-class Energy Dispersive Spectroscopy (EDS) and Electron Backscatter ...
EDAX Inc.
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Feb 1, 2012
Touchstone Semiconductor Launches the Touchstone Video Channe
Touchstone Semiconductor announced it has launched the new Touchstone Video Channel featuring application videos to help design engineers in applying ...
Touchstone Semiconductor
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Jan 31, 2012
Rudolph Technologies Reports 2011 Fourth Quarter and Year End Results
Rudolph Technologies, Inc. announced financial results for the fourth quarter and year end of 2011. Fourth quarter revenue exceeded guidance and increased ...
Rudolph Technologies, Inc.
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Jan 30, 2012
Hesse & Knipps to Discuss 'Why Wedge Bond' As Part of IPC Online Education Winter Webinars
Hesse & Knipps, Inc. will discuss "Why Wedge Bond?" versus ball bonding in satisfying fine pitch and thin package requirements as one of the IPC Online ...
Hesse & Knipps, Inc.
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