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Corporate news releases from manufacturers, supplies, and organizations supporting semiconductor packaging.
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Corporate News
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Mar 11, 2010
Imec and Synopsys Collaborate on 3D Stacked IC Development
Synopsys, Inc. and imec announced they have entered into a collaboration to use Synopsys TCAD finite-element method tools for characterizing and ...
Imec
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Mar 11, 2010
Daytime running light with only two LEDs
The OSTAR Compact from OSRAM Opto Semiconductors has been developed specifically for use in vehicle headlights. The high-power LED is designed ...
OSRAM Opto Semiconductors
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Mar 11, 2010
XYZTEC introduces Condor EZ: the next generation in bond testing
XYZTEC is pleased to introduce the new Condor EZ, the next generation in bond testing solutions. The Condor EZ offers a single platform with ...
XYZTEC
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Mar 11, 2010
Point of Care Testing: Applications of Microfluidics Technologies
Yole Développement releases its new markets & technological study, "Point of Care Testing: Applications of Microfluidics Technologies". Yole ...
Yole Développement
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Mar 10, 2010
Aerosol Jet Deposition System for Multi-Chip Packaging to be Featured at IMAPS Device Packaging Conference
Optomec announced that Mike O’Reilly, Optomec's Aerosol Jet Product Manager will give a presentation on Aerosol Jet Deposition Technology ...
Optomec
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Mar 10, 2010
Amkor Technology Installs Systems from SUSS MicroTec
SUSS MicroTec has received orders for multiple 300mm lithography systems from Amkor Technology Inc., an industry leading supplier of innovative ...
SUSS MicroTec
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Mar 10, 2010
Nordson DAGE Announces the Appointment of Hal Hendrickson
Nordson DAGE has announced that Hal Hendrickson has been appointed to the position of Sales Director – Global Accounts for its X-ray product line ...
Nordson DAGE
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Mar 10, 2010
Novellus Develops Advanced Copper Seed Technology For Through-Silicon-Via (TSV) Packaging
Novellus Systems announced that it has developed a new, advanced copper barrier-seed physical vapor deposition (PVD) process for the emerging ...
Novellus Systems
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Mar 9, 2010
Imec and Altos collaborate on chip design and prototyping service
Imec and Altos Design Automation, Inc. announce that they have entered into an agreement to set up a library re-characterization service based ...
Imec
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Mar 9, 2010
Nintendo Surpasses Samsung as Top Consumer and Wireless MEMS Buyer
Culminating a neck-and-neck race, Nintendo in 2009 surpassed Samsung to become the world’s top purchaser of Microelectromechanical Systems ...
iSuppli Corporation
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