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June 25, 2020  -  Click the title to read the full press release.

TRESKY GmbH supplies its T-6000-L to the Institute for Mechatronics
Anew high-precision placement machine, called T-6000-L from TRESKY Gmbh is now part of the Institute for Mechatronics, Faculty of Computer Science and Electrical Engineering ...

TRESKY GmbH
June 25, 2020
TRESKY GmbH supplies its T-6000-L to the Institute for Mechatronics
Anew high-precision placement machine, called T-6000-L from TRESKY Gmbh is now part of the Institute for Mechatronics, Faculty of Computer Science and Electrical Engineering ...
October 22, 2013
Tresky Holds Successful Showing at iMAPS 2013, Appoints 3 New Reps
Tresky announces that iMAPS The 46th International Symposium on Microelectronics, held in Orlando, FL from September 30-October 3, 2013, was a fruitful and ...
June 26, 2013
Tresky Appoints NW Test Solutions Inc. as Its Newest Rep
Tresky announces that it has named NW Test Solutions Inc. as its newest rep, covering the Pacific Northwest. Based in Beaverton, OR, NW Test Solutions represents ...
June 24, 2013
Tresky's Product Technologies Provide High-Quality Solutions for Microelectronics
Tresky announces that its wide range of die bonder products from simple and inexpensive to fully automatic are designed to provide simple, precise and reliable ...
June 20, 2013
Tresky to Display T-6000 Die Bonder at SEMICON West
Tresky announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition & conference, scheduled to take ...
December 17, 2010
Thermosonic Bonding -- An Advanced, Solder-less Technology
Thermosonic bonding is a simple, clean and dry process which reduces ultrasonic vibration, force and temperature avoiding damage of sensitive ...