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February 11, 2020  -  Click the title to read the full press release.

Amkor Technology Reports Financial Results for the Fourth Quarter and Full Year 2019
Amkor Technology, Inc. announced financial results for the fourth quarter and full year ended December 31, 2019. "Fourth quarter revenue grew 9% sequentially to a new ...

Amkor Technology, Inc.
February 11, 2020
Amkor Technology Reports Financial Results for the Fourth Quarter and Full Year 2019
Amkor Technology, Inc. announced financial results for the fourth quarter and full year ended December 31, 2019. "Fourth quarter revenue grew 9% sequentially to a new ...
January 29, 2020
Unit-Level Traceability for Automotive Customers
Automotive manufacturers rely on traceability to keep abreast of gaps in the value chain to meet end user safety requirements.
November 7, 2019
WLFO Technologies For a Connected World
This paper discusses innovative Wafer Fan-out technologies that meet the heterogeneous integration requirements for an increasingly connected world.
October 30, 2019
Amkor Technology Reports Financial Results for the Third Quarter 2019
Amkor Technology, Inc. announced financial results for the third quarter ended September 30, 2019. "Sequential revenue growth of 21% drove financial results above ...
September 6, 2019
PADKs Bring Value to Semiconductor Designs
Users of PADK methodology leverages existing design tool capabilities by utilizing the investment they have made and provides enhancements to simplify and speed up ...
August 1, 2019
Amkor Technology Reports Financial Results for the Second Quarter 2019
Amkor Technology, Inc. announced financial results for the second quarter ended June 30, 2019. "Second quarter profitability was at the high end of guidance, with ...
July 23, 2019
Amkor Leads 5G mmWave Smartphone, IoT and Emerging Applications with Antenna in Package Technology
Amkor Technology, Inc. is paving the way for 5G mmWave antenna in package (AiP) technology. Amkor’s cutting-edge AiP technology has already been deployed into ...
July 15, 2019
Power Packaging for Automotive Semiconductors -- Now and Future
This white paper will provide a brief overview on value creation in the electrification segment, specifically for power semiconductor packaging.
May 21, 2019
Amkor Names Daniel Liao and Gil Tily to Board of Directors
Amkor Technology, Inc. announced that Daniel Liao and Gil Tily have been appointed as new members of the Company’s Board of Directors. With these appointments ...
May 10, 2019
2.5D Package and HDFO – Advanced Heterogeneous Packaging Solutions
This article introduces packaging technology platforms developed by Amkor Technology including: 2.5D TSV interposer, CoS, CoW and HDFO.