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January 9, 2020  -  Click the title to read the full press release.

Uyemura Appoints Technology Director
Uyemura Vice President and CTO Don Gudeczauskas announces the appointment of Patrick Valentine as Director of Technology, effective immediately. Dr. Valentine ...

Uyemura International Corporation
March 17, 2020
Barrier Properties of an Electroless Deposit of Co-W-P Alloy
Paper explores the copper diffusion barrier provided by a Co-W-P layer, and the diminishment of those properties when cobalt is oxidized. Data demonstrates that higher ...
February 25, 2020
VIEWPOINT 2020: Don Gudeczauskas, Vice President, Uyemura USA
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In the semiconductor industry, smaller form factors, faster response times, and harsh environment adaptability continue to push the industry into new developments. As a specialty chemical provider, we clearly see the need to form circuits with excellent copper thickness uniformity, produce smoother copper to reduce signal loss ...
January 9, 2020
Uyemura Appoints Technology Director
Uyemura Vice President and CTO Don Gudeczauskas announces the appointment of Patrick Valentine as Director of Technology, effective immediately. Dr. Valentine ...
October 25, 2018
Optimizing Pre-treatment for Electroless Deposition on Small Pads for UBM Formation
This article describes a process for the uniform deposition of electroless nickel on sputtered or vapor deposited aluminum pads in various crystal orientations, and ...