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January 7, 2020  -  Click the title to read the full press release.

SUSS MicroTec is Planning an Acquisition of PiXDRO
SUSS MicroTec is announcing its intention to purchase PiXDRO, a division of Meyer Burger Deutschland GmbH. Both companies signed a corresponding agreement on 19 December ...

SUSS MicroTec
June 10, 2020
SUSS MicroTec and micro resist technology GmbH Partner in Advancing Nanoimprint Lithography
SUSS MicroTec and micro resist technology GmbH announce a joint venture to further advance the deployment of Nanoimprint Lithography (NIL) in the production of future ...
May 21, 2020
Smart Recovery after Handling Failure
SUSS tools offer a new scheduling feature that addresses the handling challenges caused by higher substrate warpage and brittle substrates.
April 15, 2020
New Fusion Bond Solution Available
High precision fusion bonding, and integrated metrology capability are new features for the SUSS automated permanent wafer bonding platform XBS200.
April 15, 2020
SUSS MicroTec Successfully Purchases the Inkjet Printer Division of Meyer Burger
SUSS MicroTec announces the closing of the acquisition of PiXDRO, the inkjet printing division of Meyer Burger (Netherlands) B.V. On December 20, 2019, the intention ...
March 10, 2020
New Insights with Integrated Metrology
SUSS MicroTec's new TM200/300 metrology modules reveal a clear picture of the coating process, automate tool qualification in HVM fabs and ensure precise ...
February 12, 2020
Imprint of High Quality DOEs
The SMILE technique enables the imprint of both nano- and microstructures and supports the fabrication of high quality DOEs, the basic components for AR equipment.
January 9, 2020
Adopting Dual Damascene to BEOL
A combination of a projection stepper with an excimer laser transfers the dual damascene process from the front-end to the back-end of line thus meeting the demands ...
January 7, 2020
SUSS MicroTec is Planning an Acquisition of PiXDRO
SUSS MicroTec is announcing its intention to purchase PiXDRO, a division of Meyer Burger Deutschland GmbH. Both companies signed a corresponding agreement on 19 December ...
December 5, 2019
SUSS MicroTec and BRIDG join forces to establish a production-level Applications Center in North America
SUSS MicroTec announced a far-reaching collaboration agreement with BRIDG, a not-for-profit, public-private partnership focused on production process technologies ...
March 15, 2017
SUSS MicroTec Launches XBS200 - A New Automated Permanent Wafer Bonding System
SUSS MicroTec launched a brand-new automated permanent wafer bonding system today. The XBS200 is a universal platform, designed for aligned wafer bonding of wafer sizes ...