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December 2, 2019  -  Click the title to read the full press release.

Chiplets: A Key Enabler for the Next 10-20 Years
Continued monolithic integration is expensive and can suffer from the defect density yield loss associated with large die. As a result, an increasing number of companies ...

TechSearch International
December 2, 2019
Chiplets: A Key Enabler for the Next 10-20 Years
Continued monolithic integration is expensive and can suffer from the defect density yield loss associated with large die. As a result, an increasing number of companies ...
October 15, 2019
2019 Edition of the Heterogeneous Integration Roadmap
IEEE announced the 2019 release of the Heterogeneous Integration Roadmap (HIR), a roadmap to the future of electronics identifying technology requirements ...
September 9, 2019
Infrastructure Ready or Not Companies are Shipping 5G Phones to Spur Sales
Many smartphone manufacturers are offering 5G handsets in a bid to increase mobile phone sales. Several 5G-compatible smartphones are in mass production ...
September 5, 2019
High-Performance IC Substrate Manufacturing at an Inflection Point
Driven by advanced packaging substrate needs, the industry has reached an inflection point in IC substrate manufacturing. Increasing I/O counts are driving ...
May 29, 2019
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP
TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fanout WLPs (FO-WLPs). Despite lower growth for smartphones ...
March 6, 2019
TechSearch International - Heterogeneous Integration Drives New Package Developments
The high cost of moving to the next semiconductor technology node is changing the role of packaging and
assembly in the electronics industry. Heterogeneous ...
December 18, 2018
TechSearch International - FO-WLP Panel Production Becomes a Reality
Panel FO-WLP is in production at Powertech Technology, Inc. (PTI) for MediaTek's power management integrated circuit (PMIC) for smartphone applications. The Samsung ...
November 30, 2018
TechSearch International Explores Power Device Packaging and Assembly Trends
Power devices are experiencing growth driven by demand in a variety of areas. TechSearch International projects a 4.3% growth in overall leadframe package shipments ...
July 5, 2018
TechSearch International Analyzes Potential for 3D Sensing Modules
Structured light and time of flight (ToF) are the dominant types of 3D sensing used for augmented reality, motion detection, gesture control, automotive/industrial 3D mapping ...
June 22, 2018
TechSearch International Analyzes Trends in FO-WLP including Panel Activity
While Apple remains the main customer for TSM's Integrated Fan-Out WLP (InFO-WLP), an increasing number of companies are adopting a large area version of FO on Substrate. ...