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November 26, 2019  -  Click the title to read the full press release.

Underfill Epoxy Offers Thermal Conductivity and Electrical Insulation
Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need ...

Master Bond
November 26, 2019
Underfill Epoxy Offers Thermal Conductivity and Electrical Insulation
Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications. It does not need ...
November 1, 2019
Thermally Conductive, Chemically Resistant Epoxy Sealant
Master Bond EP62-1AO is a two part epoxy adhesive and sealant with an exceptionally long working life of 12-14 hours at ambient temperature for a 100 gram mass. ...
October 14, 2019
Thermally Conductive, Electrically Insulative Potting Compound Resists High Temperatures
Master Bond Supreme 121AO is a NASA low outgassing approved epoxy suitable for bonding, sealing and potting applications. Featuring a high glass transition temperature ...
September 19, 2019
High Tg, Ultra Low Viscosity Epoxy meets NASA Low Outgassing Specifications
Master Bond Supreme 112 is a new two part epoxy for bonding, sealing, potting, and impregnation applications. It is a heat curable system with a very low viscosity of 50-200 cps ...
August 20, 2019
UV Curing Adhesive Passes NASA Low Outgassing Specifications
Master Bond UV10TK40M is a one part UV curable system, which is not oxygen inhibited, and can be used for bonding, sealing and coating applications. UV10TK40M i ...
July 22, 2019
Toughened Epoxy Polysulfide Hybrid Offers Advanced Chemical Resistance
Master Bond EP21TP-2NV is a two part epoxy polysulfide formulated for use as an adhesive, sealant and potting system. It withstands prolonged exposure to many ...
June 27, 2019
Non-Premixed and Frozen, One Part Epoxy for Chip Coating
Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a new single component epoxy initially ...
June 11, 2019
Optically Clear, Low Viscosity Epoxy System Features High Flexibility
Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. It is easy ...
May 20, 2019
Toughened, Low Outgassing, One Component Epoxy Features Thermal Cycling Resistance
Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature. ...
April 25, 2019
Dual Curing Epoxy Meets Biocompatibility and Cytotoxicity Requirements
Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. Not only does it pass USP Class VI tests ...