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November 7, 2019  -  Click the title to read the full press release.

Indium Corporation Expert to Present at EPTC
Indium Corporation's Kenneth Thum, Senior Technical Support Engineer, will present at IEEE EPTC Singapore 2019, December 4-6, in Singapore. The development of heterogeneous ...

Indium Corporation
November 7, 2019
Indium Corporation Expert to Present at EPTC
Indium Corporation's Kenneth Thum, Senior Technical Support Engineer, will present at IEEE EPTC Singapore 2019, December 4-6, in Singapore. The development of heterogeneous ...
November 1, 2019
Indium's Vareha-Walsh Shared Insights at Int'l Lead and Zinc Study Group Conference
Indium Corporation's Donna Vareha-Walsh, Director, Metals Business Unit, shared her industry expertise at the International Lead and Zinc Study Group conference ...
October 28, 2019
Indium Features WS-446HF Flip-Chip and Ball-Attach Flux at IEEE EPTC Singapore 2019
Indium Corporation will feature its new combined flip-chip and ball-attach flux, designed to provide a simple solution to SiP and flip-chip BGA assembly, at IEEE EPTC Singapore ...
October 22, 2019
Indium Corporation to Feature Hybrid Metal Thermal Interface Materials at Semi-Therm Workshop
Indium Corporation will feature its unique solid/liquid hybrid thermal interface materials—m2TIMTM—at the Semi-Therm Thermal Technologies Workshop, Nov. 4-6 ...
September 30, 2019
Indium Corporation Expert to Present at Thermal LIVE™ Webinar
Indium Corporation's Tim Jensen, Senior Product Manager for Engineered Solder Materials, will host a 45-minute Thermal LIVE™ webinar at 10:15 a.m., Oct. 22, regarding ...
September 19, 2019
Elements of Indium by Indium Corporation: Wetting
Indium Corporation is the global leader for indium metal and associated technologies. Because of its unique properties with virtually limitless applications, indium metal ...
September 18, 2019
Indium Corporation Expert to Present at IMAPS Autumn Conference 2019
Indium Corporation expert Andreas Karch, Regional Technical Manager, Germany, Austria, and Switzerland, will present at the IMAPS Autumn Conference 2019, October 17-18 ...
August 28, 2019
Indium Corporation Expert to Present at EMPC 2019
Indium Corporation expert Graham Wilson, Applications Engineer, will share his industry expertise at the 22nd European Microelectronics and Packaging Conference ...
August 27, 2019
Indium Corporation Expert to Present at SEMICON Taiwan
Indium Corporation's Jason Chou, Area Technical Manager - Taiwan, will present at SEMICON Taiwan 2019, September 18-20 in Taipei, Taiwan. Chou will present Challenges ...
August 26, 2019
Indium Corporation to Feature Materials for HIA at Electronics Packaging Symposium
Indium Corporation will feature its proven materials for Heterogeneous Integration & Assembly (HIA) at the 31st Annual Electronics Packaging Symposium, September 5-6 ...