| Press Release |
September 5, 2019 - Click the title to read the full press release.
Nordson ASYMTEK will highlight fluid dispensing systems, applications, processes, and best practices for advanced packaging assembly at the D-Tek Technology booth #I2312 ...
Nordson ASYMTEK
March 7, 2024
Nordson Electronics Solutions to demonstrate plasma treatment and automated fluid dispensing systems at SEMICON China
Nordson Electronics Solutions will demonstrate their latest equipment for semiconductor manufacturing at SEMICON China 2024, booth 3645. Plasma removes impurities ...
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January 17, 2024
VIEWPOINT 2024: Justin Hall, Vice President, Nordson Electronics Solutions
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August 16, 2023
Nordson's semiconductor advanced packaging solutions will be demonstrated at SEMICON Taiwan 2023
Nordson Electronics Solutions will demonstrate the latest solutions for semiconductor advanced packaging at the SEMICON Taiwan tradeshow booth L0800, Hall 1, 4th floor. ...
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June 29, 2023
Nordson Electronics Solutions to demonstrate popular automated fluid dispensing systems at SEMICON China
Nordson Electronics Solutions will demonstrate their latest solutions for semiconductor packaging and electronics manufacturing, with partner ...
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January 24, 2023
VIEWPOINT 2023: Justin Hall, Vice President, Nordson Electronics Solutions
Here at Nordson Electronics Solutions, we've set record sales with our fluid dispensing and plasma surface treatment systems in the semiconductor segment for the last two years. These sales have been hard-won as we navigated COVID, supply chain and logistical problems, as well as attracting enough talent to service the strong growth. Many of these issues are now behind us and we are stronger moving forward, even though new headwinds are appearing. ...
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May 12, 2022
Nordson Electronics Solutions introduces new Helios® system
Nordson Electronics Solutions introduces a system-solution for dispensing single ...
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January 18, 2022
VIEWPOINT 2022: Srini Subramanian, Vice President, Nordson Electronics Solutions
It is paradoxical that 2021 has been the most difficult for so many of us while at the same time, one of the most rewarding. We battled first and foremost the COVID pandemic and continued to adapt to the necessity to isolate and work from home. But then we have also been rewarded with one of the most successful years ...
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October 16, 2020
Plasma Treatment during Fan-out Wafer-Level Packaging Optimizes Performance and Costs
Fan-out Wafer-Level (FOWLP) and Fan-out Panel-Level (FOPLP) semiconductor packaging benefit from plasma treatment, which ensures surfaces are ...
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January 21, 2020
VIEWPOINT 2020: Peter Bierhuis, President, Nordson ASYMTEK
Nordson ASYMTEK sees a successful outlook for 2020. We have always focused on being a full solutions provider - driving our technology to tailor products for the various applications we serve. In 2019, we introduced many new dispensing and conformal coating products and are now leveraging the new capabilities ...
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September 5, 2019
Nordson ASYMTEK's Application Engineers Will Discuss Dispensing for Advanced Packaging at SEMICON Taiwan
Nordson ASYMTEK will highlight fluid dispensing systems, applications, processes, and best practices for advanced packaging assembly at the D-Tek Technology booth #I2312 ...
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