Press Release
August 21, 2019  -  Click the title to read the full press release.

Hesse Mechatronics Announce Latest Hires



Hesse Mechatronics is pleased to announce our latest hires that will address our growing business in the newly emerging battery and energy storage markets. Both ...

Hesse Mechatronics
August 21, 2019
Hesse Mechatronics Announce Latest Hires
Hesse Mechatronics is pleased to announce our latest hires that will address our growing business in the newly emerging battery and energy storage markets. Both ...
August 9, 2018
Hesse Mechatronics Announces Two New Key Employees
Hesse Mechatronics Inc. have announced the addition of two new key employees, Mr. Rene Cruz and Mr. Vicmark Divinagracia. Rene Cruz joined Hesse Mechatronics ...
February 11, 2013
Joseph S. Bubel, President, The Americas, Hesse Mechatronics
Effective January 1, 2013, Hesse & Knipps will become Hesse Mechatronics. This change is a move back to the company's roots, named Hesse GmbH when first launched in 1986. The new name signifies more accurately what we do -- which is to develop and manufacture the most advanced thin wire wedge bonders and heavy wire bonders in the world utilizing mechatronics, or a multidisciplinary engineering approach. Our outlook for 2013 in the ...
February 21, 2012
Joseph S. Bubel, President, Hesse & Knipps, Inc.
At Hesse & Knipps, Inc. we experienced significant growth in 2011, with a 50% increase in revenue over FY2010. Our forecast remains strong for this year, with growth expected for heavy wire bonding technology in the power electronics market. We also project continued dominance in the thin wire bonding market with continued growth into the RF and microwave market segment ...
June 14, 2011
Why Wedge Bond?
Until now, ball bonding has dominated the interconnect market because of its high speed and capabilities, however ball bonding is reaching its ...
April 13, 2010
Exceeding Productivity Demands for Heavy Wire Bonding
A large portion of the cycle time for wedge bonding, is used for the ultrasonic welding process. To achieve an increase in productivity ...
August 8, 2008
Process Integrated Quality Control for Wire Bonding
As costs of field failures keep increasing in many fields of electronic applications, achievement of zero failure rates of the goods delivered ...
August 8, 2008
Ribbon Bonding for High Frequency Applications
Due to increasing frequencies in all fields of information technology, ribbon bonding is gaining more widespread attention from designers of ...
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