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August 21, 2019  -  Click the title to read the full press release.

MRSI improves accuracy to 1.5 micrometers for MRSI-H/HVM-Series die bonders
MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series product line. Placement accuracy was tested using industry-standard ...

MRSI Systems (Mycronic Group)
September 3, 2019
MRSI Systems welcomes Hendry He as China Country Sales Director
MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and ...
August 27, 2019
MRSI to present at 18th ICCSZ OC and offer die bonder demonstrations at CIOE
MRSI Systems and CYCAD Century Science and Technology will partner together at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be ...
August 21, 2019
MRSI improves accuracy to 1.5 micrometers for MRSI-H/HVM-Series die bonders
MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series product line. Placement accuracy was tested using industry-standard ...
March 28, 2019
Challenges & Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors
Delivery of cost effective assembly solutions for smaller, faster electronic packages for end markets in Telecom/Datacom, Aerospace & Defense, Medical Devices, Computers, ...
February 12, 2019
MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing
MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand ......
January 14, 2019
VIEWPOINT 2019: Michael Chalsen, President, MRSI Systems
Michael_Chalse_60-75n.jpg
MRSI Systems enters 2019 with two new product families MRSI-HVM3 and MRSI-H3 (complementing our traditional market-leading MRSI-705 and MRSI-M3 products for R&D/medium volume production). These two product families are targeted towards high-volume applications driven by 5G wireless, data center, telecommunication ...
November 13, 2018
MRSI Announces HVM3 die Bonding Demonstration Capability in Shenzhen China
MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district ...
September 6, 2018
MRSI Systems Announces 'One Stop Shop' Die Bonding Solutions at CIOE and ECOC
MRSI Systems (Mycronic Group) will be demonstrating our "One Stop Shop" capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen ...
September 4, 2018
MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market
MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3mm high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used ...
August 30, 2018
MRSI Launches new MRSI-H3TO Die Bonding Product Family
MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3mm high speed die bonder which will be the first of its kind to address the multi-die and multi-process ...