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August 12, 2019  -  Click the title to read the full press release.

Indium Corporation Launches New Indium Oxide
Indium Corporation has released IndiOx™ (In2O3) for use in the manufacture of ITO sputtering targets for thin-film coating. IndiOx™ (In2O3) is a stable ceramic-like material ...

Indium Corporation
August 23, 2019
Indium Corporation to Feature Materials for HIA at Electronics Packaging Symposium
Indium Corporation will feature its proven materials for Heterogeneous Integration & Assembly (HIA) at the 31st Annual Electronics Packaging Symposium, September 5-6 ...
August 22, 2019
Indium Features WS-446HF Flip-Chip and Ball-Attach Flux at SEMICON Taiwan
Indium Corporation will feature its WS-446HF Flux for both flip-chip and ball-attach processes at SEMICON Taiwan 2019, September 18-20, in Taipei, Taiwan. WS-446HF flux  ...
August 16, 2019
Indium Corporation Experts to Present at IMAPS Boston
Three Indium Corporation experts will share their expertise at the 52nd International Symposium on Electronics (IMAPS) Boston, September 30–October 3, Boston ...
August 12, 2019
Indium Corporation Launches New Indium Oxide
Indium Corporation has released IndiOx™ (In2O3) for use in the manufacture of ITO sputtering targets for thin-film coating. IndiOx™ (In2O3) is a stable ceramic-like material ...
August 5, 2019
Indium Corporation to Feature LV1000 Preforms at IMAPS Boston
Indium Corporation will feature its LV1000 flux-coated solder preforms for 5G infrastructure at the 52nd International Symposium on Electronics (IMAPS) Boston, September ...
June 27, 2019
Indium Corporation Introduces Non-Silicone-Based TIM for Burn-in and Test
Indium Corporation has added to its line of thermal interface materials (TIMs) with the introduction of HSMF-OS, a non-silicone based metal/polymer material ...
June 20, 2019
Indium Corporation to Feature AuSn Solder Preforms at HiTEN 2019
Indium Corporation will feature its high-reliability precision AuSn Solder Preforms at the International Conference and Exhibition on High Temperature Electronics ...
June 10, 2019
Indium Corporation to Feature Solder Paste for HIA, SiP at IMAPS Advanced SiP
Indium Corporation will feature its proven solder paste for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications at Advanced System ...
May 16, 2019
Indium Corporation Expert to Present at IMAPS Advanced SiP
Indium Corporation's Sze Pei Lim, Regional Product Manager for Semiconductor Products, will share her expertise at the Advanced System in Package (SiP) Technology ...
May 9, 2019
Indium Corporation's Vareha-Walsh Elected to MMTA Board of Directors
Indium Corporation's Donna Vareha-Walsh, Director, Metals Business Unit, has been elected to the Minor Metals Trade Association (MMTA) board of directors and was ...