Press Release
July 17, 2019  -  Click the title to read the full press release.

YINCAE Advanced Materials to Exhibit and Present at IMAPS 2019 in Boston



YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year's IMAPS 2019 Boston 52nd International Symposium on Microelectronics, at the Hynes ...

YINCAE Advanced Materials, LLC
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YINCAE Launches Snap Cure, Highly filled,100% No-Clean Flux Residue Compatible Underfill: UF 120HA
YINCAE ha announced the launch of its new product UF 120HA. The innovative underfill material is specifically designed to provide a fast-flow, lower temperature cure for high ...
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YINCAE Launches Breakthrough Thermal Underfill: UF158A2
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Fully Flux Residue Compatible, Room Temperature Fast Flow, Reworkable Underfill SMT 88UL2
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Diamond Filled Underfill: SMT 158D8
YINCAE is excited to announce that we have developed SMT 158D8 a high thermal conductive underfill that is capillary and fast flowing, and an easy reworkable liquid epoxy. SMT 158D8 ...
July 17, 2019
YINCAE Advanced Materials to Exhibit and Present at IMAPS 2019 in Boston
YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year's IMAPS 2019 Boston 52nd International Symposium on Microelectronics, at the Hynes ...
April 11, 2019
IMAPS New England Symposium & Expo 2019 - 4 weeks away
IMAPS New England Symposium & Expo 2019, will be held at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA on May 7, 2019. YINCAE Advanced ...
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YINCAE Advanced Materials to Exhibit and Present at IMAPS
YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year's IMAPS New England Symposium & Expo 2019, at the Boxboro Regency Hotel ...
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