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July 9, 2019  -  Click the title to read the full press release.

EV Group Earns Exceptional Seventh Consecutive Triple Crown Win
EV Group announced that it has once again been voted by customers as one of the 10 BEST Focused Suppliers of Chip Making Equipment and one of the 2019 THE BEST ...

EV Group
July 9, 2019
EV Group Earns Exceptional Seventh Consecutive Triple Crown Win
EV Group announced that it has once again been voted by customers as one of the 10 BEST Focused Suppliers of Chip Making Equipment and one of the 2019 THE BEST ...
June 25, 2019
EV Group Invests 30 Million Euros for Capacity Expansion at Corporate Headquarters in Austria
EV Group (EVG) announced that it has begun construction on another extensive building project at its corporate headquarters in St. Florian am Inn, Austria. With an ...
June 13, 2019
EV Group Brings Nanoimprint Lithography to Full-Scale Production
EV Group unveiled the HERCULES® NIL 300 mm--a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG's ...
May 23, 2019
EV Group Wafer Bonding Solutions Highlighted at ECTC 2019
EV Group announced that new developments in heterogeneous integration and wafer-level packaging enabled by its advanced wafer bonding solutions will be highlighted ...
March 25, 2019
EV Group Partners with NSI to Enable First Wafer-level Heterogeneous Integration of GaAs on Silicon
EV Group (EVG) announced that it has partnered with Ningbo Semiconductor International Corporation (NSI), a specialty semiconductor foundry based in Ningbo ...
March 14, 2019
EV Group and Panasonic Team Up on Resist Processing Solution for Plasma Dicing
EV Group (EVG) and Panasonic Smart Factory Solutions Co., Ltd. announced that both companies have teamed up to provide a novel resist processing solution for plasma ...
January 16, 2019
VIEWPOINT 2019: Thomas Uhrmann, Director of Business Development, EV Group
Thomas-Uhrmann_2019_60-75.jpg
The semiconductor industry is experiencing a profound shift in what is driving its future innovation. Increasingly, fewer device manufacturers are able to follow the path of "More Moore" and lithographically scale to smaller design nodes due to the exponentially rising costs associated with optical and EUV lithography ...
December 4, 2018
EV Group Unveils Next-Generation Fusion Wafer Bonder
EV Group introduced the all new BONDSCALE™ automated production fusion bonding system. BONDSCALE is designed to fulfill a wide range of fusion/molecular wafer ...
November 21, 2018
EV Group partners with Plessey to drive GaN-on-Silicon monolithic microLED technology for AR applications
Plessey announces a collaboration with EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor ...
November 19, 2018
IHP - Innovations for High Performance Microelectronics Cooperates with EV Group
EV Group (EVG) announced that IHP - Innovations for High Performance Microelectronics (IHP), a German research institute for silicon-based systems, highest-frequency ...