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May 13, 2019  -  Click the title to read the full press release.

Rudolph Receives First Order for StepFAST Solution for Fan-out Panel-level Packaging
Rudolph Technologies, Inc. announced that a leading outsourced assembly and test facility (OSAT) has ordered Rudolph's exclusive StepFAST™ Solution for panel-level ...

Rudolph Technologies, Inc.
May 13, 2019
Rudolph Receives First Order for StepFAST Solution for Fan-out Panel-level Packaging
Rudolph Technologies, Inc. announced that a leading outsourced assembly and test facility (OSAT) has ordered Rudolph's exclusive StepFAST™ Solution for panel-level ...
March 21, 2019
Rudolph Technologies Introduces New JetStep Lithography Systems at SEMICON China 2019
Rudolph Technologies, Inc. announced the immediate availability of its new JetStep® lithography systems for advanced packaging processes on wafer and panel ...
January 18, 2019
Rudolph Technologies Receives Orders for Over $15 Million from Major Memory Manufacturer
Rudolph Technologies, Inc. announced that it has received orders for over $15 million of legacy and new process control systems from a memory manufacturer based ...
January 14, 2019
Rudolph Announces Orders for Multiple Inspection Systems
Rudolph Technologies, Inc. announced that it has received orders for 12 of its Dragonfly™ G2 system, just months after releasing the product. Several systems ...
November 5, 2018
Rudolph Announces NovusEdge for Unpatterned Wafer Inspection
Rudolph Technologies, Inc. announced the availability of its NovusEdge™ system for edge, notch and backside inspection of unpatterned wafers. The company plans ...
September 5, 2018
Rudolph Technologies Launches Second-Gen Dragonfly Inspection and Metrology System
Rudolph Technologies, Inc. announced its new Dragonfly™ G2 platform, which incorporates many of the benefits of the Firefly™ system onto the Dragonfly platform, ...
January 18, 2018
Rudolph Announces $21M in Orders from Memory Market
Rudolph Technologies, Inc. announced that it has received over $21 million (USD) in orders for process control solutions from two customers: a Korean-based ...
September 18, 2017
Rudolph Announces Multiple Customers' Acceptance of its Firefly Inspection System
Rudolph Technologies, Inc. announced that its Firefly™ Inspection Systems, shipped to fulfill previously announced orders from multiple semiconductor ...
September 14, 2017
Rudolph Announces Truebump Technology 3D Metrology for Advanced Packaging
Rudolph Technologies, Inc. announces new Truebump™ Technology on the Dragonfly™ Inspection System. Truebump Technology provides fast, accurate and repeatable ...
August 4, 2017
Rudolph Expands in China for AMOLED Panel Lithography
Rudolph Technologies, Inc. announced that it has received an order for a JetStep® G lithography system from a second customer in China for pilot line manufacturing ...