We search for industry news, so you don't need to.
May 13, 2019  -  Click the title to read the full press release.

5G- and Automotive ADAS-enabling Henkel Materials Featured at ECTC 2019
The drive to develop electronic materials capable of handling the reliability and performance demands of emerging integrated packages for 5G wireless communication ...

Henkel Corporation
May 13, 2019
5G- and Automotive ADAS-enabling Henkel Materials Featured at ECTC 2019
The drive to develop electronic materials capable of handling the reliability and performance demands of emerging integrated packages for 5G wireless communication ...
April 4, 2019
Henkel Debuts Assembly Adhesive for Optical Fiber Applications
Henkel Corporation's Adhesive Electronics (AE) business announced the commercial availability of a new, high-strength adhesive designed for streamlined assembly of optical components ...
January 15, 2019
VIEWPOINT 2019: Poupak Khodabandeh, Vice President and Global Head Semiconductor Packaging Materials, Henkel Corporation
Poupak-Khodabandeh-2019_60-.jpg
The electronics assembly value chain is in the midst of a renaissance and the semiconductor packaging industry is at the center of this transformation. Significant consolidation and shifts across the pillars of the electronics assembly industry -- with impacts to the semiconductor packaging ecosystem -- are being driven ...
November 12, 2018
Peelable Thermal Interface Material (TIM) from Henkel Recognized with Industry Accolade
Notching its second notable industry prize, Henkel's BERGQUIST® Gap Filler TGF 1500RW liquid thermal interface material recently took top honors ...
September 18, 2018
New Assembly Film from Henkel Raises the Bar on Reliability
Henkel Corporation has announced the development of a high performance assembly film designed for applications where extreme reliability is required. The material, LOCTITE® ABLESTIK® ...
August 10, 2018
High Thermal, Semi-Sintering Die Attach Paste a Breakthrough for Emerging Package Performance Requirements
Henkel has developed and commercialized a novel series of die attach materials to facilitate package-level sintering, addressing the regulatory challenges of high-lead solders, thermal ...
February 14, 2018
VIEWPOINT 2018: Poupak Khodabandeh, VP, Henkel Electronic Materials LLC
Poupak-Khodabandeh_2018_60-75.jpg
With growth in the data storage, industrial and IoT sectors, and the proliferation of sensor technology across multiple applications, Henkel anticipates continued strong semiconductor market performance. These market dynamics and resultant device designs will require materials with unique performance characteristics ...
November 19, 2017
EMI Protection at the Package Level
Miniaturization and SiP advances are driving a need for more effective EMI shielding at the package level. Two new approaches from Henkel are providing ...
September 14, 2017
Henkel Conformal Coating Metal Inks for Package-Level EMI Shielding
Henkel Adhesive Technologies' Electronics business announced the introduction of two novel, conformal coating metal inks for semiconductor package-level electromagnetic ...
May 31, 2017
Bump Protection Gets a Boost
Emerging semiconductor applications that incorporate TSV and Cu Pillar technology have been challenged by the limits of conventional capillary ...