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May 14, 2019  -  Click the title to read the full press release.

UTAC announces license for iBGA packaging technology
UTAC Holdings Ltd. is pleased to announce that it has, via its subsidiary UTAC Headquarters Pte. Ltd. secured a license for relevant patents relating to imaging ball ...

UTAC Group
March 3, 2020
Thermal and Mechanical Analysis of Imaging BGA Image Sensor Package
The growing demand of smartphone, cameras and automotive pushes image sensor packaging to smaller form factor and more complex substrate design. A study is ...
February 10, 2020
VIEWPOINT 2020: Asif R Chowdhury, Senior VP, Marketing & Corporate Business Development & Japan Business, UTAC
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2019 was unfortunately not a great year for overall semiconductor market. Analysts estimate that unit shipment in 2019 will be down by more than 4% - first time semiconductor unit shipment will go negative since 2001. Minus memory, part of slow 2019 was due to slow mobile handset sales which is one of the dominant users ...
February 5, 2020
New Development of Thermally Enhanced GaN QFN with Heat Slug Attach Bonding Technology
GaN mosfet provides significantly lower resistance and low capacitance than silicon mosfet which makes GaN mosfet considered as alternative power devices to replace ...
December 19, 2019
UTAC receives safety-critical automotive quality accreditation for three factory locations
UTAC Holdings Ltd. announced that three further factories have been accredited to the stringent automotive quality standard, ISO26262. Following the recent announcement  ...
November 19, 2019
UTAC receives accreditation to safety-critical automotive quality standard
UTAC Holdings Ltd. announced that they have been awarded the prestigious automotive-related quality standard ISO26262 for their automotive manufacturing focused ...
August 1, 2019
Delivering automotive quality IC packaging technology
Growth in the automotive market comes with demanding performance and quality requirements. New enabling technologies means strategic partnerships with ...
July 2, 2019
CMOS Image Sensor Packaging Technology for Automotive Applications
In this paper, we present novel methods for packaging image sensors on laminate substrates, enabling a reduction in cost, form factor and time-to-market whilst ...
June 5, 2019
New Generation Routable QFN for Power SiP Applications
To overcome several limitations in package assembly, UTAC is developing an inkjet insulation process for GQFN (GQFNi), targeting to provide a cost-effective ...
May 14, 2019
UTAC announces license for iBGA packaging technology
UTAC Holdings Ltd. is pleased to announce that it has, via its subsidiary UTAC Headquarters Pte. Ltd. secured a license for relevant patents relating to imaging ball ...
April 29, 2019
11 Myths About SiP
The prevalence of system-in-package technology in a host of different applications has invariably led to myths about it. UTAC's Lee Smith dispels some of these fallacies.