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January 10, 2019  -  Click the title to read the full press release.

Low Viscosity, Thermally Conductive Underfill Epoxy
Master Bond EP3UF-1 is a new single component epoxy that is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal ...

Master Bond
July 19, 2019
Toughened Epoxy Polysulfide Hybrid Offers Advanced Chemical Resistance
Master Bond EP21TP-2NV is a two part epoxy polysulfide formulated for use as an adhesive, sealant and potting system. It withstands prolonged exposure to many ...
June 27, 2019
Non-Premixed and Frozen, One Part Epoxy for Chip Coating
Featuring a combination of thermal conductivity and electrical insulation properties, Master Bond Supreme 3CCM-85 is a new single component epoxy initially ...
June 11, 2019
Optically Clear, Low Viscosity Epoxy System Features High Flexibility
Two component epoxy, Master Bond EP88FL, is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. It is easy ...
May 20, 2019
Toughened, Low Outgassing, One Component Epoxy Features Thermal Cycling Resistance
Master Bond Supreme 17HT is a single component, no mix epoxy system for bonding and sealing applications featuring an unlimited working life at room temperature. ...
April 25, 2019
Dual Curing Epoxy Meets Biocompatibility and Cytotoxicity Requirements
Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. Not only does it pass USP Class VI tests ...
April 3, 2019
Graphene Filled Epoxy Offers 5.5 W/(m•K) Thermal Conductivity
Master Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity. It contains a specialty graphene filler ...
March 14, 2019
Silver Conductive, One Component Epoxy Cures at 80°C
Master Bond Supreme 3HTS-80 is a one part, silver filled epoxy adhesive that is not premixed and frozen and features an unlimited working life at room temperature. ...
February 27, 2019
Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test
Master Bond EP93AOFR is a two part epoxy that may be used in encapsulation and potting applications, as well as in bonding, sealing and coating. According–...
January 10, 2019
Low Viscosity, Thermally Conductive Underfill Epoxy
Master Bond EP3UF-1 is a new single component epoxy that is not premixed and frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable thixotropic compound is ideal ...
November 29, 2018
One Component Glob Top Epoxy Meets NASA Low Outgassing Specifications
Master Bond EP17HTND-CCM is a new single component epoxy that is not premixed and frozen. It is more convenient to handle, apply and store than typical two component ...