Press Release - Palomar Technologies, Inc.
December 5, 2018  -  Click the title to read the full press release.

Palomar Technologies Offering Silver Sintering to Meet the Needs for RF GaN Power Amplifiers



Palomar Technologies announced new epoxy die attach capabilities for silver sintering. Developed to meet growing demands for RF GaN power amplifiers, which are ...

Palomar Technologies, Inc.
September 14, 2022
Palomar Technologies 3880-II Die Bonder honored by 2022 Military + Aerospace Electronics Innovators Awards
Palomar Technologies announced that its Palomar 3880-II Die Bonder was recognized among ...
September 8, 2022
Palomar Technologies Appoints New Managing Director for its European Operations
Palomar Technologies announced the appointment of Mr. Thorsten Scheidler as the new managing director for its European operations effective October 1, 2022. ...
August 25, 2022
Palomar Technologies Places Palomar 9000 Wedge Bonder with Bay Photonics
Palomar Technologies announced that Bay Photonics, an advanced photonics assembly and packaging company has taken delivery of a Palomar 9000 Wedge Bonder as a ...
July 29, 2022
The Great Debate: Ball Bonding vs Wedge Bonding
Over the years, microelectronic wire bond process and packaging engineers have debated whether to use ball or wedge bond technologies. This article will focus on the ...
June 7, 2022
Palomar Technologies offers Webinar on How to Increase Semiconductor Packaging Throughput
Palomar Technologies announced they are offering a webinar focused on the many aspects to increasing manufacture throughput for semiconductor packaging: Throughput ...
June 2, 2022
The Journey to Full-Scale Semiconductor Packaging Manufacturing
The challenges faced from package design and prototyping, through process development and process optimization are presented to ensure the device can indeed be ...
October 26, 2021
Efficient Manufacture of IR Sensors
The market for IR sensing devices has been growing steadily but the challenge is how to manufacture them efficiently to achieve ROI.
August 27, 2021
Balancing Throughput and Process Control for RF Power Amplifier Assemblies
Learn techniques for optimizing RF transistor packaging during the die bonding process. Learn how to maximize throughput in production while implementing ...
July 1, 2021
Power Modules: Typical Failure Modes and how to Avoid them
The soldered interface between the power die and the substrate to the base plate are critical points for failure. Learn how to reduce these failures.
June 22, 2021
Palomar Technologies Presents Process Control & Traceability for Military and High-Reliability Semiconductors in Webinar
Palomar Technologies announced they are offering a free webinar outlining how to improve processes and traceability for semiconductor packaging for military and high-reliability ...
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