Press Release - Finetech
November 2, 2018  -  Click the title to read the full press release.

Stanford Nanofabrication Facility Partners with Finetech on Die Bonding Technologies



The FINEPLACER® Lambda, a flexible sub-micron die bonder for precision die attach and chip packaging, is an integral part of the SNF lab's equipment capabilities ...

Finetech
October 11, 2023
Finetech announces FINEPLACER® pico 2 purchase by AmTECH Microelectronics
Finetech announces the purchase of the FINEPLACER® pico 2 by AmTECH Microelectronics, a Silicon Valley provider ...
February 20, 2023
VIEWPOINT 2023: Neil O'Brien, General Manager, Finetech
2022 was an eventful year for Finetech. Our colleagues in Germany with Ukrainian and Russian roots, had to deal with the sad reality of the Ukraine invasion. I am proud to share that Finetech GmbH reacted swiftly and donated 50,000 EUR to an emergency Ukraine aid fund. Finetech celebrated its 30th anniversary ...
March 8, 2022
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Finetech announces the completion of a Class 1000 (ISO 6) clean room to its US facility in Amherst, New Hampshire. The building houses the Finetech eastern sales and applications ...
July 9, 2021
Thermocompression Bonding: Process and Challenges
Thermocompression bonding has many advantages and shows excellent connection properties while maintaining high accuracy. The paper explores thermocompression ...
September 14, 2020
New Femtoblu Micro Assembly Cell for Photonic Component Assembly
FINETECH announces the latest addition to the FINEPLACER® family, the FINEPLACER® femtoblu bonding system. This automated micro assembly cell is an efficient and ...
February 26, 2020
VIEWPOINT 2020: Neil O'Brien, General Manager and COO, Finetech
As we enter 2020, there are many emerging technologies that when combined, should continue to fuel growth in the advanced packaging world. As a supplier of die bonding solutions to academia, R&D, defense, and commercial production, Finetech has a unique view of the most exciting technologies coming to market. Some ...
August 6, 2019
FINETECH Expands with New Customer Center in Amherst, New Hampshire
FINETECH announces its new, larger facility in Amherst, New Hampshire. The stand-alone building houses the Finetech eastern sales and applications support team. Its extensive ...
November 2, 2018
Stanford Nanofabrication Facility Partners with Finetech on Die Bonding Technologies
The FINEPLACER® Lambda, a flexible sub-micron die bonder for precision die attach and chip packaging, is an integral part of the SNF lab's equipment capabilities ...
July 19, 2017
Universal Instruments Installs Finetech Multipurpose Bonder
Finetech and Universal Instruments announce the addition of a FINEPLACER° Pico bonding system to the Universal Instruments Advanced Process Laboratory. The Universal ...
January 24, 2017
Finetech's Sigma Bonder Selected for Canada's National Optics Institute
Finetech and the National Optics Institute (INO) announce the addition of a FINEPLACER® Sigma bonding system at INO's micro-opto-electromechanical systems facility. ...
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