| Press Release - CoorsTek, Inc. |
July 16, 2018 - Click the title to read the full press release.
CoorsTek, Inc. announced that David Lee has joined the company as global vice president - commercial for the global semiconductor business, a group dedicated to ...
CoorsTek, Inc.
July 26, 2022
CoorsTek Announces Capacity Investments in Japan
CoorsTek KK (Tokyo, Japan) announced that its parent company, CoorsTek, Inc.'s board of directors has approved a capital ...
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July 16, 2018
CoorsTek Names David Lee as Global Vice President for Semiconductor Business
CoorsTek, Inc. announced that David Lee has joined the company as global vice president - commercial for the global semiconductor business, a group dedicated to ...
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June 13, 2016
CoorsTek Unveils Enhanced GaN-on-Silicon Epiwafers at ISPSD 2016
CoorsTek will unveil its enhanced Gallium Nitride on Silicon (GaN-on-Si) epiwafers at next week's International Symposium on Power Semiconductor Devices ...
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January 27, 2016
VIEWPOINT 2016: Greg Heras, Director of Sales, CoorsTek
The miniaturization movement and the rise in the use of copper wire have continued to drive innovations in the semiconductor packaging industry. CoorsTek Gaiser® has always been at the forefront of new technology development. In 2016, CoorsTek Gaiser proudly introduces the RF4 ...
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January 6, 2016
Evolution of the Ceramic Capillary
The introduction of copper into semiconductor assembly processing has increased the level of difficulty to achieve proper welding between ...
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