Press Release - TechSearch International
June 22, 2018  -  Click the title to read the full press release.

TechSearch International Analyzes Trends in FO-WLP including Panel Activity



While Apple remains the main customer for TSM's Integrated Fan-Out WLP (InFO-WLP), an increasing number of companies are adopting a large area version of FO on Substrate. ...

TechSearch International
November 8, 2023
TechSearch International, Inc. Examines Drivers for Co-Packaged Optics
The need for high interconnect bandwidth capacity and improved I/O power efficiency, especially in hyperscale datacenters, continues to drive the development of co-packaged ...
August 1, 2023
TechSearch International, Inc. Examines Advanced Packaging's Growth in AI
TechSearch International's latest analysis examines demand for packages used in AI. As the industry enters the AI era, successful hardware deployment requires a supply ...
May 24, 2023
TechSearch's Market Forecast for BGAs and CSPs Reveals the Downside of the Covid Spending Spree
TechSearch International's latest analysis explains the tough year ahead for semiconductor companies, OSATs, and foundries after the record highs from the Covid-induced ...
December 15, 2022
2022 Semiconductor Materials Market Concludes as Another Solid Year
TECHCET announced that the Total Semiconductor Materials market in 2022 is expected to top US$66 billion after strong semiconductor demand through the first three quarters—
November 22, 2022
TechSearch International Analyzes Impact of Slowing Demand on FC and WLP
TechSearch International's latest report: 2022 Flip Chip and WLP: Trends and Market Forecasts examines the impact of slowing consumer demand on the flip chip and WLP ...
July 27, 2022
TechSearch Int'l Examines High-Performance Package Options
TechSearch International's latest analysis describes high-performance package options with an update on TSMC's new offerings, including ...
May 18, 2022
TechSearch International's Analysis Examines Impact of World Events, Material Shortages
2021 was a record year for the semiconductor industry and OSAT revenues, but the outlook ...
March 1, 2022
Semiconductor Assembly and Test Facility Database Now Tracks Integrated Device Manufacturers
SEMI and TechSearch International announced a new edition of the Worldwide Assembly & Test Facility Database offering significantly expanded coverage that now includes integrated ...
February 15, 2022
TechSearch International's Analysis Shows Build-up Substrate Shortage Could End in 2026
The shortage of build-up substrates will be worse this year than in 2021, and the gap between supply and demand looms even larger in 2023. Many substrate makers are adding ...
August 9, 2021
TechSearch International's Analysis Shows Shortage of FC-BGAs Substrates Persists
Despite capacity increases this year, and additional plans through 2025, demand for FC-BGA substrates is outstripping supply. What's driving the insatiable demand? ...
Free Newsletter Subscription
Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address