| Press Release - AT&S |
June 20, 2018 - Click the title to read the full press release.
Significantly higher data rates and volumes together with high power densities are resulting in rising requirements for interconnection technologies, too. The new 5G ...
AT&S
October 20, 2021
AT&S continues to invest in its Leoben site
In view of the ongoing boom in demand in the microelectronics sector and ever-new performance requirements for electronic systems, AT&S has decided to put an even stronger ...
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June 10, 2020
AT&S fights energy losses in microelectronics
Energy plays a crucial role in microelectronics. As electronic components are becoming increasingly more powerful, they also require more energy. Scientists and technology companies ...
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June 20, 2018
AT&S offers interconnection technologies for next-generation 5G mobile communications
Significantly higher data rates and volumes together with high power densities are resulting in rising requirements for interconnection technologies, too. The new 5G ...
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May 4, 2018
AT&S offers a look into the future of connection technology: From the PCB to the all-in-one package
In Velden (Austria), AT&S presented innovative technologies and trends in connection solutions at the 14th AT&S Technology Forum. Numerous interested customers ...
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March 6, 2017
AT&S advances PCB, module and packaging technologies
For years, AT&S has worked at the forefront of process and technology development to meet the challenges of continued miniaturization and the demand for better energy ...
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