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| Press Release - Boschman Technologies and Advanced Packaging Center |
May 25, 2018
Visit Boschman Technologies and Advanced Packaging Center at PCIMBoschman Technologies and Advanced Packaging Center will exhibit again at the PCIM show on June 5th-7th in Nürnberg Germany their Transfer Molding and Silver Sintering technology. We will have our Sinterstar Innovate F-XL at the show and we will provide samples on die-clip sintering on a ceramic substrate. With these samples we also introduce our new sinter services ranging for a basic test (die on substrate only), via a premium test (die and clip on substrate) all the way to a fully customized test. Other new material to be presented will include: * adjacent die sintering with spacing as small as 400 micron * full summary and characterization of all sinter solutions offered by Boschman * overview on process control, monitoring, recording and traceability * full option overview of all molding and sintering systems for increasing the productivity, ease of use and quality assurance We hope to see you in Nürnberg. Boschman Technologies and Advanced Packaging Center For more information visit: http://www.APCenter.nl |
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