We search for industry news, so you don't need to.
Press Releases

March 6, 2018  -  Click the title to read the full press release.

TechSearch International Analysis Shows Packaging for Cryptocurrancy Provides a Windfall
Projections for PC growth are flat and shipments of smartphones show low growth rates. Demand for cryptocurrency devices in flip chip CSPs and BGAs is expected to provide increased ...

TechSearch International
July 5, 2018
TechSearch International Analyzes Potential for 3D Sensing Modules
Structured light and time of flight (ToF) are the dominant types of 3D sensing used for augmented reality, motion detection, gesture control, automotive/industrial 3D mapping ...
June 22, 2018
TechSearch International Analyzes Trends in FO-WLP including Panel Activity
While Apple remains the main customer for TSM's Integrated Fan-Out WLP (InFO-WLP), an increasing number of companies are adopting a large area version of FO on Substrate. ...
March 6, 2018
TechSearch International Analysis Shows Packaging for Cryptocurrancy Provides a Windfall
Projections for PC growth are flat and shipments of smartphones show low growth rates. Demand for cryptocurrency devices in flip chip CSPs and BGAs is expected to provide increased ...
January 3, 2018
TechSearch International Analyzes New Automotive Packaging Trends
More than 80 companies are developing autonomous vehicles and many more are involved in providing sensors and computational systems for advanced driver assistance ...
November 21, 2017
TechSearch Int'l Forecasts Growth for High-Density FO-WLP and Examines Panel Potential
Growth for high-density fan-out wafer level packages continues unabated, with Apple's continued use of TSMC's InFO process in its smartphone application processors. ...
April 18, 2017
TechSearch International Analyzes High-Performance Package Trends
A variety of alternatives are challenging silicon's role in advanced packaging interposers for highperformance applications. The first applications using silicon interposers ...
January 24, 2017
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP
TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fanout WLP (FO-WLP). Driven by demand for thin, low-profile packages ...
January 20, 2017
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP
TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fanout WLP (FO-WLP). Driven by demand for thin, low-profile ...
October 28, 2016
TechSearch International Analysis Shows CSP Growth Remains Strong
Despite a slowing growth rate for smartphones, the industry is experiencing strong growth for CSP packages such as QFNs and stacked die CSPs. TechSearch International's ...
July 28, 2016
Wearables Packages Enabled by Advances in Assembly and Packaging
Strong market growth is predicted for wearable electronics fueled by new generations of wearables providing greater functionality in the same or smaller form factor, for the same ...