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Press Releases

February 5, 2018  -  Click the title to read the full press release.

Nordson MARCH's MesoSPHERE Plasma System for high-throughput semiconductor packaging
Nordson MARCH introduces the MesoSPHERE™ Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out ...

Nordson MARCH
February 7, 2018
VIEWPOINT 2018: Daniel Chir, Product Line Manager, Nordson MARCH
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2017 was a record year for the semiconductor industry and Nordson MARCH took part in that trend. Now, we look to 2018 for what will affect the demand for plasma tools. In the semiconductor packaging market, we see the mobile, wireless and memory segments continue to drive our product development efforts and focus. ...
February 5, 2018
Nordson MARCH's MesoSPHERE Plasma System for high-throughput semiconductor packaging
Nordson MARCH introduces the MesoSPHERE™ Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out ...
February 9, 2017
Nordson MARCH's New Plasma Polymerization Deposition Systems
Nordson MARCH introduces its PD Series Plasma Deposition Systems family, which uses plasma polymerization to deposit thin films uniformly during precision manufacturing ...
September 22, 2016
Nordson MARCH's Plasma Confinement Ring Increases Etch Rate and Improves Treatment Uniformity for Wafer Processing
Nordson MARCH introduces its Plasma Confinement Ring for wafer processing and wafer fan-out applications. The ring concentrates and focuses the plasma directly ...
February 18, 2016
VIEWPOINT 2016: Jonathan Doan, Director of Marketing, Nordson MARCH
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2015 was another great year for Nordson MARCH, especially with the adoption of our liquid-vapor deposition (LVD) platforms. Similar to 2014, we shifted priorities towards manufacturing over product development, but kept steady with our schedule to introduce some new products for the 2016 calendar. ...
August 24, 2015
Nordson MARCH StratoSPHERE Plasma Treatment System Expands Up to 6 Chambers
Nordson MARCH announces that its StratoSPHERE™ Series plasma treatment equipment for wafer-level packaging and 3D packaging applications can now be configured in two, four, and even six ...
July 6, 2015
Nordson MARCH Introduces the SPHERE Series Plasma Treatment Systems
Nordson MARCH announces its new SPHERE(TM) Series plasma systems for wafer-level and 3D packaging applications. Based on Nordson MARCH's TRAK(TM) Series ...
March 12, 2015
Nordson MARCH Wins 2015 NPI Award for its FlexVIA-Plus Plasma Treatment System
Nordson MARCH has won the 2015 New Product Introduction (NPI) Award in the General Cleaning category for its FlexVIA-Plus(TM) Plasma Treatment System. The ...
January 30, 2015
Jonathan Doan, Director of Marketing, Nordson MARCH
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For the markets that Nordson MARCH serves, we see strong growth in wafer-level packaging (WLP), not only for chip-scale WLP (CS-WLP) but further up the semiconductor line where the wafers are thinned and singulated. Our customers are moving towards packaging when the wafer is still on the carrier or some film. Our new, thinned wafer plasma chamber was specifically developed for these customers. Nordson MARCH's core market of plasma prior ...
October 2, 2014
Nordson MARCH Presents Plasma Cleaning Papers at ECS/SMEQ, Cancún
Nordson MARCH will present two papers at The Electrochemical Society (ECS) and Sociedad Mexicana de Electroquímica (SMEQ) Joint International Meeting ...