| Press Release - Nordson MARCH |
February 5, 2018 - Click the title to read the full press release.
Nordson MARCH introduces the MesoSPHERE™ Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out ...
Nordson MARCH
January 20, 2020
Nordson MARCH Introduces PROGENY Plasma Treatment System
Nordson MARCH introduces the PROGENY™ plasma treatment system with a chamber that is 2 meters deep with overall dimensions of 660mm W x 2260mm D x 660mm H ...
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January 13, 2020
VIEWPOINT 2020: Al Bousetta, Director of Marketing, Nordson MARCH
The global economy is still a concern with the ongoing uncertainties about the "trade war" with China and its impact on the packaging market, particularly the PCB market in China. Nordson MARCH's global leadership with financial strength and more than 30 years in designing and manufacturing plasma equipment differentiates us. ...
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August 12, 2019
Nordson MARCH to Present Paper on Plasma Applications for Wafer-Level Packaging at ICEPT
Nordson MARCH will present the paper, "Plasma Applications for Wafer Level Packaging, Part 1," at the 20th annual International Conference on Electronic Packaging Technology ...
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April 2, 2019
Nordson MARCH Introduces its FlexTRAK-SHS High-capacity Plasma Treatment System
Nordson MARCH announces the introduction of its FlexTRAK®-SHS automated plasma treatment system. The plasma system includes the 9.6-liter (585 in3) large-volume ...
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January 8, 2019
VIEWPOINT 2019: Daniel Chir, Product Line Manager, Nordson MARCH
While the outlook for 2019 may look hazy, the trends are clearly in autonomous vehicles, data processing/AI, and mobile computing, which will drive innovation in the semiconductor industry. Nordson MARCH will invest in our core plasma technology and bring to market advanced plasma systems that serve the industry's needs. ...
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February 7, 2018
VIEWPOINT 2018: Daniel Chir, Product Line Manager, Nordson MARCH
2017 was a record year for the semiconductor industry and Nordson MARCH took part in that trend. Now, we look to 2018 for what will affect the demand for plasma tools. In the semiconductor packaging market, we see the mobile, wireless and memory segments continue to drive our product development efforts and focus. ...
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February 5, 2018
Nordson MARCH's MesoSPHERE Plasma System for high-throughput semiconductor packaging
Nordson MARCH introduces the MesoSPHERE™ Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out ...
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February 9, 2017
Nordson MARCH's New Plasma Polymerization Deposition Systems
Nordson MARCH introduces its PD Series Plasma Deposition Systems family, which uses plasma polymerization to deposit thin films uniformly during precision manufacturing ...
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September 22, 2016
Nordson MARCH's Plasma Confinement Ring Increases Etch Rate and Improves Treatment Uniformity for Wafer Processing
Nordson MARCH introduces its Plasma Confinement Ring for wafer processing and wafer fan-out applications. The ring concentrates and focuses the plasma directly ...
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February 26, 2016
Plasma for Underfill Process in Flip Chip Packaging
Plasma treatment prior to the underfill dispensing process brings many benefits including increased wicking speed, improved fillet height and ...
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