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Press Releases

November 30, 2017  -  Click the title to read the full press release.

SHENMAO sponsors and exhibits at MEPTEC Semiconductor Packaging Symposium
SHENMAO Technology, Inc. introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder ...

SHENMAO
November 30, 2017
SHENMAO sponsors and exhibits at MEPTEC Semiconductor Packaging Symposium
SHENMAO Technology, Inc. introduces New Generation Lead-free Zero Halogen Solder Paste PF606-P245. With superior continuous high-speed printability producing great Solder ...
October 24, 2017
SHENMAO Exhibits at IWLPC
SHENMAO Technology. Inc. introduces New Generation Ultra Low Residue Liquid Flux SMF-WB51 with superior spray uniformity, excellent soldering performance and ...
July 10, 2017
SHENMAO Exhibits at SEMICON WEST -- Introduces New Low Residue Liquid Flux SMF-B51
SHENMAO Technology. Inc. introduces New Generation Ultra Low Residue Liquid Flux SMF-B51 with superior spray uniformity, excellent soldering performance and ...
June 26, 2017
SHENMAO Exhibits at IMAPS System in Package June 27
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place ...
March 27, 2017
SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V.
Omega Aleaciones S.V. Sales and Application Engineering Team reinforces SHENMAO's commitment to providing our worldwide EMS and OEM customers with the highest quality ...
August 24, 2016
SHENMAO Exhibits at SEMICON TAIWAN
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, MBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals ...
July 12, 2016
SHENMAO Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux At Semicon West
SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 9 other worldwide locations. It is said their Low Viscosity ...
July 11, 2016
SHENMAO Introduces BGA and Micro BGA Bumping Solder Paste at Semicon West
SHENMAO Bumping Solder Paste PF608-PI-21 and PF606-P-BS1 aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers ...
July 6, 2016
SHENMAO Exhibits at SEMICON WEST
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to ...
May 23, 2016
SHENMAO Exhibits at ECTC in Las Vegas
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various ...