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Press Releases

November 21, 2017  -  Click the title to read the full press release.

TechSearch Int'l Forecasts Growth for High-Density FO-WLP and Examines Panel Potential
Growth for high-density fan-out wafer level packages continues unabated, with Apple's continued use of TSMC's InFO process in its smartphone application processors. ...

TechSearch International
March 6, 2018
TechSearch International Analysis Shows Packaging for Cryptocurrancy Provides a Windfall
Projections for PC growth are flat and shipments of smartphones show low growth rates. Demand for cryptocurrency devices in flip chip CSPs and BGAs is expected to provide increased ...
January 3, 2018
TechSearch International Analyzes New Automotive Packaging Trends
More than 80 companies are developing autonomous vehicles and many more are involved in providing sensors and computational systems for advanced driver assistance ...
November 21, 2017
TechSearch Int'l Forecasts Growth for High-Density FO-WLP and Examines Panel Potential
Growth for high-density fan-out wafer level packages continues unabated, with Apple's continued use of TSMC's InFO process in its smartphone application processors. ...
April 18, 2017
TechSearch International Analyzes High-Performance Package Trends
A variety of alternatives are challenging silicon's role in advanced packaging interposers for highperformance applications. The first applications using silicon interposers ...
January 24, 2017
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP
TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fanout WLP (FO-WLP). Driven by demand for thin, low-profile packages ...
January 20, 2017
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP
TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fanout WLP (FO-WLP). Driven by demand for thin, low-profile ...
October 28, 2016
TechSearch International Analysis Shows CSP Growth Remains Strong
Despite a slowing growth rate for smartphones, the industry is experiencing strong growth for CSP packages such as QFNs and stacked die CSPs. TechSearch International's ...
July 28, 2016
Wearables Packages Enabled by Advances in Assembly and Packaging
Strong market growth is predicted for wearable electronics fueled by new generations of wearables providing greater functionality in the same or smaller form factor, for the same ...
March 9, 2016
Miniaturization Trends Drive Growth in SiP Market
With the proliferation of mobile electronic products and the ongoing push for greater functionality in a smaller area, miniaturization has become a key word for system-in-package ...
August 21, 2015
TechSearch International Analyzes CSP Market Growth
Driven by use in mobile products such as smartphones, CSPs continue to show growth. TechSearch International's latest CSP market forecast shows ...