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Press Releases

November 8, 2017  -  Click the title to read the full press release.

Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS
StratEdge Corporation announces that its packages for high-frequency and very high power devices will be featured by Elecsys, LLC at IEEE COMCAS, November 13-15, 2017 ...

StratEdge Corporation
November 8, 2017
Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS
StratEdge Corporation announces that its packages for high-frequency and very high power devices will be featured by Elecsys, LLC at IEEE COMCAS, November 13-15, 2017 ...
October 18, 2017
StratEdge Molded Ceramic Packages Meet GaN Mil-Std Packaging Requirements
StratEdge Corporation announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz ...
August 21, 2017
Marty Daniel Joins StratEdge as Account Manager
StratEdge Corporation announces the selection of Marshall "Marty" Daniel as its new account manager. Ms. Daniel will drive new business development and customer relations ..
August 1, 2017
StratEdge Introduces New, Mobile-Friendly Website
StratEdge Corporation announces its new mobile friendly website: www.stratedge.com. The website provides detailed information about StratEdge's complete line of DC to 63+ GHz packages ...
May 5, 2017
StratEdge Semiconductor Packages Now Sold on Amazon.com
StratEdge Corporation announces the opening of its Amazon Store to sell its off-the-shelf high-frequency packages. "It is a relatively new concept to use Amazon ...
June 18, 2012
StratEdge Introduces Laminate Packages for High Power GaN Devices
StratEdge Corporation introduces a new family of high power laminate packages at IMS2012 Booth #1625. The LL family of leaded laminate copper-moly-copper (CMC) ...