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Press Releases

November 8, 2017  -  Click the title to read the full press release.

Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS
StratEdge Corporation announces that its packages for high-frequency and very high power devices will be featured by Elecsys, LLC at IEEE COMCAS, November 13-15, 2017 ...

StratEdge Corporation
September 27, 2018
StratEdge to Display GaN and GaAs Packages at IMAPS, BCICTS, and EDI CON USA
StratEdge Corporation will display its high-frequency, high-speed, thermally efficient packages at IMAPS, BCICTS, and EDI CON USA. StratEdge's packages meet the extreme ...
August 27, 2018
StratEdge Receives ISO 9001:2015 Quality Management Systems Certification
StratEdge Corporation announces that DNV GL -- Business Assurance has found StratEdge Corporation to conform to the Quality Management System standard ISO 9001:2015. ...
May 1, 2018
StratEdge to Display High-Temp and High-Reliability Packages at CS ManTech and IMAPS HiTEC
StratEdge Corporation will be exhibiting at both the IMAPS HiTEC Electronics and CS ManTech conferences the week of May 7. StratEdge will be highlighting the latest ...
March 6, 2018
StratEdge to Display High-Performance DC-63GHz Packages at IMAPS Device Conference
StratEdge Corporation announces that it will display its high-frequency and very high-power device packages in booth 62 at the IMAPS Device Conference. The conference ...
February 2, 2018
VIEWPOINT 2018: Tim Going, President, StratEdge
Tim-Going_60-75.jpg
Packaging high-frequency semiconductor devices has always been an afterthought, but 5G and its high-power infrastructure and IoT and advanced cellular technologies requiring RF and microwave frequencies will make package selection critical. Packages not only are necessary for heat dissipation, but also ensure ...
November 8, 2017
Elecsys to Feature StratEdge High-performance Semiconductor Packages at IEEE COMCAS
StratEdge Corporation announces that its packages for high-frequency and very high power devices will be featured by Elecsys, LLC at IEEE COMCAS, November 13-15, 2017 ...
October 18, 2017
StratEdge Molded Ceramic Packages Meet GaN Mil-Std Packaging Requirements
StratEdge Corporation announces that its off-the-shelf line of molded ceramic packages can be configured to meet the requirements for chips with frequencies up to 18 GHz ...
August 21, 2017
Marty Daniel Joins StratEdge as Account Manager
StratEdge Corporation announces the selection of Marshall "Marty" Daniel as its new account manager. Ms. Daniel will drive new business development and customer relations ..
August 1, 2017
StratEdge Introduces New, Mobile-Friendly Website
StratEdge Corporation announces its new mobile friendly website: www.stratedge.com. The website provides detailed information about StratEdge's complete line of DC to 63+ GHz packages ...
May 5, 2017
StratEdge Semiconductor Packages Now Sold on Amazon.com
StratEdge Corporation announces the opening of its Amazon Store to sell its off-the-shelf high-frequency packages. "It is a relatively new concept to use Amazon ...