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Press Releases

October 16, 2017  -  Click the title to read the full press release.

Indium Corporation Features Indium3.2HF Solder Paste for Fine Feature Printing at IWLPC
Indium Corporation will feature its Indium3.2HF Solder Paste at the 14th International Wafer-Level Packaging Conference (IWLPC 2017-Silicon to Systems), Oct. 24-26, in San Jose, Calif. ...

Indium Corporation
January 16, 2018
Indium Corporation Announces New Corporate Leadership
Indium Corporation has promoted Greg Evans to CEO, and Ross Berntson to President and COO. Former CEO and company owner William Macartney III will continue serving ...
January 15, 2018
Indium Technology Experts to Present at Pan Pacific Microelectronics Symposium 2018
Indium Corporation's Dr. Ron Lasky, Senior Technologist, and Sze Pei Lim, Semiconductor Product Manager for Asia, will present at Pan Pacific Microelectronics Symposium ...
December 11, 2017
Indium Corporation Promotes Brown to Associate Director, Marketing Communications
Indium Corporation has named Anita Brown as Associate Director, Marketing Communications. Brown is responsible for managing the strategic planning initiatives for the Marcom Department ...
December 5, 2017
Indium Logistics Expert Shares Metal Supply & Demand at Global Minor Metals
Indium Corporation's Donna Vareha-Walsh, Director, Metals Business Unit, shared insights into the global supply and demand for indium at the 2017 Global Minor Metals Forum ...
November 20, 2017
Indium Corporation Announces New Corporate Leadership
Indium Corporation has promoted Greg Evans to CEO, and Ross Berntson to President and COO. Former CEO and company owner William Macartney III will continue serving ...
October 16, 2017
Indium Corporation Features Indium3.2HF Solder Paste for Fine Feature Printing at IWLPC
Indium Corporation will feature its Indium3.2HF Solder Paste at the 14th International Wafer-Level Packaging Conference (IWLPC 2017-Silicon to Systems), Oct. 24-26, in San Jose, Calif. ...
October 13, 2017
Indium Corporation Expert to Present at IWLPC 2017
Indium Corporations Dr. Yan Liu, Research Chemist, will present at the 14th International Wafer-Level Packaging Conference (IWLPC 2017--Silicon to Systems), Oct. 24-26 ...
October 9, 2017
Indium Corporation's Soldering Materials for SiP in Over One Billion FEM Devices
From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation's portfolio of solder pastes have been designed to meet the current and evolving ...
September 21, 2017
Indium Corporation Expands Global Corporate Leadership Team
Indium Corporation has expanded the responsibilities of its global leadership team with the promotion of several top executives. Brian Reid serves as Vice President ...
September 20, 2017
Indium's Vareha-Walsh to Present at Minor Metals Trade Association in Germany
Indium Corporation's Donna Vareha-Walsh, Director, Metals Business Unit, will share her perspective on supply and demand in the European mining and metals industry ,,,