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Press Releases

September 19, 2017  -  Click the title to read the full press release.

Indium Corporation Experts to Present at IMAPS 2017
Indium Corporation experts will share their knowledge and expertise at IMAPS 50th International Symposium on Microelectronics, Oct. 10-12, in Raleigh, NC. ...

Indium Corporation
October 15, 2018
Indium Corporation to Feature Soldering Materials for HIA at IWLPC 2018
Indium Corporation will feature its proven soldering materials for Heterogeneous Integration & Assembly (HIA) applications at the 15th Annual International ...
October 12, 2018
Indium Corporation Expert to Present at IMAPS Autumn Conference in Munich
Indium Corporation expert, Andreas Karch, will present at the IMAPS Autumn Conference, Oct. 18-19 in Munich, Germany. At the conference, Karch will deliver his presentation ...
September 14, 2018
Indium Corporation Expert Hosts Thermal Live™ Webinar
Indium Corporation's Tim Jensen, Product Manager for Engineered Solder Materials, will host a one-hour Thermal Live™ webinar at 10 a.m. EST on Oct. 23 regarding ...
September 10, 2018
Indium Corporation Experts to Present at IMAPS 2018
Indium Corporation experts will share their industry knowledge and skill at IMAPS 2018 from Oct. 8-11 in Pasadena, Calif. The following technical presentations from ...
September 5, 2018
Indium Corporation Expert to Present at TechXPOT at SEMICON Taiwan
Indium Corporation's Jason Chou, Area Technical Manager for Taiwan, will share his technical expertise at TechXPOT at SEMICON Taiwan 2018 on Sept. 6 in Taipei, Taiwan ...
August 30, 2018
Indium Corporation to Feature InFORMS® Reinforced Solder Preforms at IMAPS 2018
Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at IMAPS 2018, Oct. 8-11 in Pasadena, Calif. Indium Corporation is redefining ...
August 28, 2018
Indium Features WS-446HF Flip-Chip and WS-823 Ball-Attach Fluxes at SEMICON Taiwan
Indium Corporation will feature its Flip-Chip Flux WS-446HF and Ball Attach Flux WS-823 at SEMICON Taiwan 2018 Sept. 5-7 in Taipei, Taiwan. Indium Corporation's WS-446HF ...
August 20, 2018
Indium Features Indium3.2HF Solder Paste for Fine Feature Printing at SEMICON Taiwan
Indium Corporation will feature its Indium3.2HF Solder Paste at SEMICON Taiwan 2018 September 5-7 in Taipei, Taiwan. Indium Corporation's Indium3.2HF is a water-soluble ...
May 29, 2018
Indium Corporation Expert to Present at ECTC
Indium Corporation expert, Dr. Ning-Cheng Lee, Vice President of Technology, will present at the Institute of Electrical and Electronics Engineers (IEEE) 68th Electronic Components ...
May 14, 2018
Indium Expert to Present at SEMICON South East Asia Advanced Packaging Forum
Indium Corporation's Sze Pei Lim, Regional Product Manager for Semiconductor Products, will share her expertise at SEMICON South East Asia's Advanced Packaging Forum ...