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Press Releases

September 14, 2017  -  Click the title to read the full press release.

Henkel Conformal Coating Metal Inks for Package-Level EMI Shielding
Henkel Adhesive Technologies' Electronics business announced the introduction of two novel, conformal coating metal inks for semiconductor package-level electromagnetic ...

Henkel Electronics Materials, LLC
September 14, 2017
Henkel Conformal Coating Metal Inks for Package-Level EMI Shielding
Henkel Adhesive Technologies' Electronics business announced the introduction of two novel, conformal coating metal inks for semiconductor package-level electromagnetic ...
January 30, 2017
VIEWPOINT 2017: Poupak Khodabandeh, Global Head, Semiconductor Packaging Materials Steering Unit, Henkel Electronics Materials, LLC
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The new growth leader for electronics is automotive and, in this sector, companies value reliability and stability -- not just in product performance, but also in supplier partners. With over 30 years of proven success in semiconductor materials innovation, experienced sales and technical service teams and a broad ...
November 23, 2016
Henkel Wins Best Paper Award
With shrinking dimensions and increased function, the need for adaptable and effective thermal solutions to ensure electronics reliability is greater than ever ...
April 4, 2016
Henkel Develops Thermally Conductive Technomelt® Solution
Adding functional capability to its award-winning Technomelt® hot melt encapsulants, Henkel Adhesive Technologies announced another formulation milestone ...
March 4, 2016
Henkel Liqui-Form® 3500 One-Part Gel a Breakthrough
Henkel Adhesive Technologies announced an addition to its line of Bergquist Liqui-Form® Thermal Interface Materials (TIMs) with the market introduction of Liqui-Form 3500. ...
January 25, 2016
VIEWPOINT 2016: Doug Dixon, Global Marketing Director, Henkel Electronics Materials, LLC
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With China becoming increasingly more important in the semiconductor industry, as evidenced by the recent high-profile acquisitions, Henkel continues our keen focus on this region. Our China-based salesforce has tripled and we have earmarked more R&D resources for technology development ...
December 10, 2015
Henkel's GAP FILLER 1400SL Offers Robust Thermal Performance & Void Filling
Henkel Adhesive Technologies continues to expand its thermal materials portfolio and today announced the development and commercialization of GAP FILLER 1400SL. ...
August 20, 2015
Henkel Develops Extremely Low Stress Thermal Interface Material
Henkel announced that it has developed the market's first-ever extremely low stress thermal interface material that unites thermal conductivity with EMI absorption ...
June 8, 2015
Henkel Leads Series C Investment in Vitriflex, Inc.
Based on the strong, continued progress in developing customized, integrated barrier films for display applications, The Electronics Group of Henkel announced that it ...
May 13, 2015
Enabling a bright new Future
The United Nations General Assembly proclaimed 2015 as the International Year of Light and Light-based Technologies. Over the past years, global megatrends ...