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Press Releases

September 14, 2017  -  Click the title to read the full press release.

Henkel Conformal Coating Metal Inks for Package-Level EMI Shielding
Henkel Adhesive Technologies' Electronics business announced the introduction of two novel, conformal coating metal inks for semiconductor package-level electromagnetic ...

Henkel Electronics Materials, LLC
November 12, 2018
Peelable Thermal Interface Material (TIM) from Henkel Recognized with Industry Accolade
Notching its second notable industry prize, Henkel's BERGQUIST® Gap Filler TGF 1500RW liquid thermal interface material recently took top honors ...
September 18, 2018
New Assembly Film from Henkel Raises the Bar on Reliability
Henkel Corporation has announced the development of a high performance assembly film designed for applications where extreme reliability is required. The material, LOCTITE® ABLESTIK® ...
August 10, 2018
High Thermal, Semi-Sintering Die Attach Paste a Breakthrough for Emerging Package Performance Requirements
Henkel has developed and commercialized a novel series of die attach materials to facilitate package-level sintering, addressing the regulatory challenges of high-lead solders, thermal ...
February 14, 2018
VIEWPOINT 2018: Poupak Khodabandeh, VP, Henkel Electronic Materials LLC
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With growth in the data storage, industrial and IoT sectors, and the proliferation of sensor technology across multiple applications, Henkel anticipates continued strong semiconductor market performance. These market dynamics and resultant device designs will require materials with unique performance characteristics ...
September 14, 2017
Henkel Conformal Coating Metal Inks for Package-Level EMI Shielding
Henkel Adhesive Technologies' Electronics business announced the introduction of two novel, conformal coating metal inks for semiconductor package-level electromagnetic ...
January 30, 2017
VIEWPOINT 2017: Poupak Khodabandeh, Global Head, Semiconductor Packaging Materials Steering Unit, Henkel Electronics Materials, LLC
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The new growth leader for electronics is automotive and, in this sector, companies value reliability and stability -- not just in product performance, but also in supplier partners. With over 30 years of proven success in semiconductor materials innovation, experienced sales and technical service teams and a broad ...
November 23, 2016
Henkel Wins Best Paper Award
With shrinking dimensions and increased function, the need for adaptable and effective thermal solutions to ensure electronics reliability is greater than ever ...
April 4, 2016
Henkel Develops Thermally Conductive Technomelt® Solution
Adding functional capability to its award-winning Technomelt® hot melt encapsulants, Henkel Adhesive Technologies announced another formulation milestone ...
March 4, 2016
Henkel Liqui-Form® 3500 One-Part Gel a Breakthrough
Henkel Adhesive Technologies announced an addition to its line of Bergquist Liqui-Form® Thermal Interface Materials (TIMs) with the market introduction of Liqui-Form 3500. ...
January 25, 2016
VIEWPOINT 2016: Doug Dixon, Global Marketing Director, Henkel Electronics Materials, LLC
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With China becoming increasingly more important in the semiconductor industry, as evidenced by the recent high-profile acquisitions, Henkel continues our keen focus on this region. Our China-based salesforce has tripled and we have earmarked more R&D resources for technology development ...