January 5, 2023
Wafer-Level Packaging Symposium (WLPS) Program Announced and Registration Now Open
The SMTA has announced the accepted speakers for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 14-16, 2023 at the Marriott Fremont ...
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January 4, 2022
Wafer-Level Packaging Symposium Program Announced, Registration Open
The SMTA is pleased to announce the technical program for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 15-17, 2022 at the DoubleTree ...
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August 9, 2021
Wafer-Level Packaging Symposium Announced
The Wafer-Level Packaging Symposium is scheduled for February 15-17, 2022 in San Jose, CA, USA. The theme of the event is "Advanced Packaging: The Dawn of a New Era." ...
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October 13, 2020
IWLPC Panel Addresses Future Advanced Packaging Challenges
The International Wafer-Level Packaging Conference and Expo announces a panel discussion titled "Meeting Future Advanced Packaging Challenges: What's Next?" ...
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September 4, 2020
Samsung VP to Keynote IWLPC
The International Wafer-Level Packaging Conference and Expo announces Dan Oh, Ph.D., Engineering VP of the Test & System Package (TSP) unit at Samsung Electronics will deliver ...
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September 2, 2020
Samsung VP to Keynote IWLPC
The International Wafer-Level Packaging Conference and Expo announces Dan Oh, Ph.D., Engineering VP of the Test & System Package (TSP) unit at Samsung Electronics will ...
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July 22, 2019
IWLPC Program Announced and Registration Now Open
The Surface Mount Technology Association (SMTA) and Chip Scale Review are pleased to announce the program for the 16th annual International Wafer-Level Packaging ...
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February 26, 2019
Submit an abstract for eSmart Factory Conference 2019
Robotic and Cobot technologies are also central to these new smart factory environments. Robots are increasingly employed for repetitive assembly areas ...
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February 5, 2019
IWLPC Technical Committee Announces Best Presentation & Papers Awards for 2018
The IWLPC Technical Committee is pleased to announce the Best of Conference, Best Presentation & Best Papers in WLP, 3D, Advanced Manufacturing and Test tracks ...
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December 8, 2017
Pan Pacific Microelectronics Symposium Program Finalized
SMTA announced that the program is finalized for the 23rd Annual Pan Pacific Microelectronics Symposium. The event will take place February 5-8, 2018 at the Hapuna Beach ...
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