Press Release - ZESTRON
August 22, 2017  -  Click the title to read the full press release.

ZESTRON Americas Announces New Regional Sales Manager



ZESTRON is pleased to announce the addition of Nick Iwata as the new Western Regional Sales Manager. "Mr. Iwata is an excellent addition to our global team," says Sal Sparacino ...

ZESTRON
March 1, 2024
ZESTRON to Present at Upcoming iMAPS Device Packaging Conference
ZESTRON proudly announces Senior Application Engineer Ravi Parthasarathy will be presenting defluxing strategies for high-density advanced packaging with ultra-fine ...
February 13, 2024
Compatibility of pH-Neutral Cleaning Agent with Under-bump Materials
Flip-chip technology is widely used in advanced packaging assembly due to its higher level integration, multiple functionalities, thinner package, better processing performance &, etc.
February 6, 2024
ZESTRON to Present "Optimizing High Bandwidth Memory (HBM) Wafer Surface Treatment" at SMTA WLP
ZESTRON proudly announces that Senior Application Engineer Ravi Parthasarathy will be presenting a technical session titled "Optimizing High Bandwidth Memory (HBM) ...
October 18, 2023
ZESTRON Academy Hosts FREE Webinar with Evan Griffith from Indium Corporation
ZESTRON is excited to announce an upcoming webinar titled "Cleaning Performance Evaluations and Best Practices for Novel Jettable Pastes ...
October 16, 2023
iNEMI Workshop on Advanced Packaging and its Impact on mm/Wave Applications
ZESTRON is proud to co-sponsor the upcoming workshop, "Advanced Packaging and its Impact on mm/Wave Applications," in collaboration ...
October 11, 2023
ZESTRON South Asia releases whitepaper on Compatibility of pH-Neutral Cleaning Agent
ZESTRON is pleased to release the whitepaper "Compatibility of pH-Neutral Cleaning Agent with Under-bump Materials." Flip-chip technology ...
September 18, 2023
Indium Corporation Expert to Present at iNEMI Seminar Hosted by Zestron Germany
Indium Corporation Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will present at iNEMI's upcoming seminar, Humidity Robustness ...
September 12, 2023
ZESTRON's Advanced Packaging and Power Electronics Webinar Series Continues with "Corrosion in Power Electronics."
ZESTRON is excited to announce the next installment of the Advanced Packaging and ...
August 25, 2023
ZESTRON South Asia to host Free Cleaning Webinar
Zestron South Asia is pleased to announce that it will host "Impact Of High Peak Reflow Temperature On Flux Remocal Of High Pb Solder Paste" free webinar on 8th September ...
August 24, 2023
Critical Cleaning Requirements to Overcome Advanced Packaging and Defluxing Challenges
As technology advances, wafer-level packages have emerged in many different varieties. Computing has evolved significantly over the years.
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