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Press Releases

August 21, 2017  -  Click the title to read the full press release.

iMAPS is 2 months away - visit YINCAE booth 416
IMAPS New England 50th Symposium & Expo is 2 months away! The tradeshow will take place at Raleigh Convention Center in Raleigh, North Carolina, on October 10th and 11th ...

YINCAE Advanced Materials, LLC
July 5, 2018
New Highly Conductive Thermal Underfill: SMT 158D
YINCAE Advanced Materials is proud to introduce SMT 158D, the world's first (and only) diamond filled underfill! SMT 158D was developed in response to the need for ...
June 29, 2018
SEMICON WEST 2018 is 2 Weeeks Away! Visit YINCAE Booth 5269
SEMICON West 2018, North America's premier Microelectronics event, is less than two weeks away! The show will be held at the Moscone Center in San Francisco, CA ...
June 8, 2018
SEMICON WEST 2018 is in 1 Month! Visit YINCAE Booth 5269
SEMICON WEST 2018 is just 1 month away! The tradeshow will take place at the Moscone Center in San Francisco, California, July 10 to 12. YINCAE hopes you will ...
April 3, 2018
SEMICON West is 3 months away! Visit YINCAE at Booth #5269
SEMICON West is nearly 3 months away! The tradeshow will take place at the Moscone Center, in San Francisco, CA, from July 10 thru 12, 2018. YINCAE hopes you will stop ...
February 16, 2018
DA 90 Low Temperature Die Attach Adhesive Series Materials
The DA 90 series materials are YINCAE's new low temperature die attach adhesives. The DA 90 series offers conductive and insulating options to suit a large variety ...
September 28, 2017
IMAPS 2017-Raleigh 2 weeks away, visit YINCAE Booth 416
50th International Symposium on Microelectronics (IMAPS 2017) is 2 weeks away! YINCAE is proud to announce their continued support of the IMAPS organization and will ...
September 15, 2017
YINCAE to Exhibit at IMAPS 2017 -- 1 month away
IMAPS New England 50th Symposium & Expo is less than a month away! YINCAE is proud to announce their continued support of the IMAPS organization and will exhibit ...
August 21, 2017
iMAPS is 2 months away - visit YINCAE booth 416
IMAPS New England 50th Symposium & Expo is 2 months away! The tradeshow will take place at Raleigh Convention Center in Raleigh, North Carolina, on October 10th and 11th ...
August 18, 2017
High Reliability & High Temperature Application Solution -- Solder Joint Encapsulant Paste
Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology -- solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International ...
August 17, 2017
High Reliability & High Throughput Ball Bumping Process Solution -- Solder Joint Encapsulant Adhesive
Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology -- solder joint encapsulant adhesives for ball bumping, at the 2017 International Symposium ...