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Press Releases

August 7, 2017  -  Click the title to read the full press release.

EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan
EV Group (EVG) announced that it is celebrating the 20th anniversary of its wholly owned subsidiary in Japan, EV Group Japan KK. Established in August 1997 in Yokohama ...

EV Group
December 20, 2017
EV Group Complete Latest Phase of Production Capacity Expansion at Corporate Headquarters
EV Group announced that it has completed construction and opened a new building at its corporate headquarters in Austria to expand capacity for producing its ...
December 13, 2017
EV Group Installs Low-temperature Plasma Activation System at the University of Tokyo
EV Group (EVG) announced it has received an order from the University of Tokyo for its EVG810LT plasma activation system for compound semiconductor research. Installed ...
November 16, 2017
Leti Demonstrates 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System
EV Group (EVG) and Leti announced the world's first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron) ...
October 10, 2017
EV Group and SwissLitho to Develop Joint Nanoimprint Lithography Solution
EV Group and SwissLitho AG announced a joint solution to enable the production of 3D structures down to the single-nanometer scale. Initially demonstrated within ...
September 12, 2017
EV Group Receives Multiple Lithography and Metrology System Orders
EV Group announced it has received multiple orders for its comprehensive portfolio of manufacturing equipment and services designed to address the burgeoning demand ...
August 7, 2017
EV Group Celebrates 20 Years of Supporting Micro- and Nano-Technology Development in Japan
EV Group (EVG) announced that it is celebrating the 20th anniversary of its wholly owned subsidiary in Japan, EV Group Japan KK. Established in August 1997 in Yokohama ...
July 10, 2017
EV Group Unveils Breakthrough Low-Temperature Laser Debonding Solution for Fan-Out Wafer-Level Packaging
EV Group (EVG) unveiled its next-generation laser debonding solution, which enables high-throughput, low-cost-of-ownership (CoO) room-temperature debonding for ultra-thin ...
June 29, 2017
EV Group Scores 5th Triple Crown Win in Annual VLSIresearch Customer Satisfaction Survey
EV Group (EVG) announced that, for the fifth successive year, it has earned all three awards resulting from VLSIresearch's annual Customer Satisfaction Survey ...
June 26, 2017
EV Group Optimizes Resist and Lithographic Processing for Plasma Dicing
EV Group (EVG) announced it is demonstrating optimized pre-processing solutions for the implementation of plasma dicing for advanced semiconductor packaging applications ...
June 1, 2017
EV Group Expands Production Capacity at Corporate Headquarters in Austria
EV Group (EVG) announced that it is expanding production capacity at its corporate headquarters in St. Florian am Inn, Austria. Representing a 20 million Euro investment ...