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Press Releases

August 7, 2017  -  Click the title to read the full press release.

Advances in Thin, 3D and MEMS Die Bond Strength Testing
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond ...

XYZTEC BV
August 7, 2017
Advances in Thin, 3D and MEMS Die Bond Strength Testing
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond ...
January 3, 2017
Coating and film testing throughput greatly enhanced
Driven by emerging technology and to suit customer special requirements XYZTEC Condor Sigma's comprehensive range of bond tests is always increasing. ...
December 6, 2016
Latest Condor Sigma software release enables automatic grading
XYZTEC has incorporated in its latest Condor Sigma software release. Customers are recommended to upgrade, so they can benefit from all the new free features. The ...
November 3, 2016
Vision enhanced materials testing
With the ever increasing complexity of modern circuits and the inherent reliability issues associated with them, it becomes necessary to adapt tools that minimize ...
October 3, 2016
XYZTEC makes lid pull easy
A new method of testing the seal and adhesive quality of a lid encapsulated devices. Typically this test is done by stud pull and gluing the lid and base of the device ...
September 12, 2016
XYZTEC automation features draw attention at Semicon Taiwan 2016
This week, XYZTEC is exhibiting the Condor Sigma at Semicon Taiwan. With two booths at the central TWTC Nangang Hall (4F), the market leader in bond testing ...
September 2, 2016
XYZTEC launches Condor Sigma W12 with large heater stage
XYZTEC is always innovating and developing advanced solutions in bond testing. In this newsletter we present the market leading Condor Sigma W12, equipped with a ...