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Press Releases

July 19, 2017  -  Click the title to read the full press release.

Universal Instruments Installs Finetech Multipurpose Bonder
Finetech and Universal Instruments announce the addition of a FINEPLACER° Pico bonding system to the Universal Instruments Advanced Process Laboratory. The Universal ...

Finetech
July 19, 2017
Universal Instruments Installs Finetech Multipurpose Bonder
Finetech and Universal Instruments announce the addition of a FINEPLACER° Pico bonding system to the Universal Instruments Advanced Process Laboratory. The Universal ...
January 24, 2017
Finetech's Sigma Bonder Selected for Canada's National Optics Institute
Finetech and the National Optics Institute (INO) announce the addition of a FINEPLACER® Sigma bonding system at INO's micro-opto-electromechanical systems facility. ...
June 27, 2016
Finetech's Lambda Bonder Installed at Lurie Nanofabrication Facility
Finetech and the University of Michigan in Ann Arbor, Michigan announce the installation of a FINEPLACER® Lambda bonding system in the university's Lurie ...
March 11, 2016
Finetech's New Sub-Micron Bonder for Automated Micro Assembly - FINEPLACER® femto 2
Finetech will introduce its high-accuracy micro assembly solution, the FINEPLACER® femto 2 , at Semicon Shanghai 2016 (March 15-17, booth #2410). ...
February 2, 2016
VIEWPOINT 2016: Neil O'Brien, General Manger, Finetech
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In preparation for 2016 and coming years, Finetech laid the groundwork in 2015 for our next generation of technology and launched the future of our manufacturing capability. We are now producing our die bonders from a newly constructed production and development center in Berlin, Germany. This ...
July 27, 2015
Finetech's New Sigma Bonder - 0.5µm Accuracy for Large Die and High Force Applications
Finetech introduces the new FINEPLACER(R) Sigma bonder, designed to provide a solution for large die up to 100mm, combined with a working area of 450 x 300 ...
July 13, 2015
Finetech's New Sigma Bonder
Finetech introduces the new FINEPLACER® Sigma bonder, designed to provide a solution for large die up to 100mm, combined with a working area ...
March 26, 2015
Finetech Opens New Production and Development Center in Germany
Finetech GmbH has opened a new, state-of-the-art production and development center in Berlin-Marzahn. The approximately 8 million euro investment in the new facility ...
January 21, 2015
Neil O'Brien, General Manger, FINETECH
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Finetech continues to offer the most precise device bonders in the market. We deliver sub-micron accuracy in a modular design not only in tabletop bonders, but also fully-automatic systems. R&D labs and engineers needing a true pathway to production see this value. Sub-micron precision is critical for the latest complex applications. When a technology change demands a new process solution, our base systems can be adapted. This is what we like ...
November 6, 2014
Finetech to Strengthen Its Presence in Japan
Finetech has announced the opening of a new Sales and Support Center in Japan. With the creation of Finetech Nippon Co., Ltd, Finetech seeks to strengthen ...