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Press Releases

June 7, 2017  -  Click the title to read the full press release.

Atotech presents NovaBond® IT at the JPCA Show 2017
Atotech will introduce NovaBond® IT, its new and innovative non-etching adhesion promoter for IC Substrates and high frequency application inner-layer bonding ...

Atotech Deutschland GmbH
October 9, 2018
Reducing manufacturing costs on Fan-Out Panel-Level Packaging
"Upscaling panel size for copper plating on FO-PLP applications to reduce manufacturing cost" will be the topic of Atotech's presentation at this year's iMAPS ...
September 7, 2018
The next revolution in electroless copper for advanced FPCB is now available
Atotech introduces a new horizontal electroless copper process specifically developed to ensure a blister-free electroless copper deposition and shiny surface ...
September 5, 2018
Atotech to exhibit and present at the SEMICON Taiwan
Atotech announced its participation at this year's SEMICON Taiwan Show, held from September 5 to 7, 2018, in the Taipei Nangang Exhibition Center Hall 1 in Taipei, Taiwan ...
May 22, 2018
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two ...
April 30, 2018
BondFilm® HF -- Atotech's new horizontal bonding enhancement solution
BondFilm® HF is Atotech's new process for the treatment of inner layer cores. It leads to highest bonding performance in the manufacture of multilayer & HDI ...
March 15, 2018
Atotech presents new solutions for (a)mSAP applications at CPCA 2018
Atotech confirmed to showcase its latest solutions for (a)mSAP application at the upcoming CPCA show in Shanghai, China, from March 20 through 22, 2018. The company has developed ...
March 12, 2018
Atotech to present MultiPlate® for Power IC at SEMICON China 2018
Atotech announced that it will present and exhibit at Semicon China 2018 to be held in Shanghai from March 14 to 16, 2018. On Friday, March 16, from 11:30 to 11:45 am ...
March 6, 2018
Atotech's MultiPlate® for FOPLP at IMAPS Device Packaging Conference
At the upcoming IMAPS Device Packaging Conference 2018, Atotech will speak about the move from Fan Out Wafer Level Packaging (FOWLP) to Fan Out Panel Level Packaging ...
November 10, 2017
Atotech to present on five topics at productronica and SEMICON Europa 2017
Atotech will join and exhibit at productronica 2017, November 14 to 17, next week in Munich. For the first time, SEMICON Europa will be co-located with productronica ...
September 14, 2017
Atotech to present leading fan-out wafer-level packaging technology at SEMICON Taiwan
Atotech is amongst the leading metallization companies in the semiconductor industry, providing cutting-edge chemistry, equipment and process solutions for advanced ...