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Press Releases

June 7, 2017  -  Click the title to read the full press release.

Atotech presents NovaBond® IT at the JPCA Show 2017
Atotech will introduce NovaBond® IT, its new and innovative non-etching adhesion promoter for IC Substrates and high frequency application inner-layer bonding ...

Atotech Deutschland GmbH
March 15, 2018
Atotech presents new solutions for (a)mSAP applications at CPCA 2018
Atotech confirmed to showcase its latest solutions for (a)mSAP application at the upcoming CPCA show in Shanghai, China, from March 20 through 22, 2018. The company has developed ...
March 12, 2018
Atotech to present MultiPlate® for Power IC at SEMICON China 2018
Atotech announced that it will present and exhibit at Semicon China 2018 to be held in Shanghai from March 14 to 16, 2018. On Friday, March 16, from 11:30 to 11:45 am ...
March 6, 2018
Atotech's MultiPlate® for FOPLP at IMAPS Device Packaging Conference
At the upcoming IMAPS Device Packaging Conference 2018, Atotech will speak about the move from Fan Out Wafer Level Packaging (FOWLP) to Fan Out Panel Level Packaging ...
November 10, 2017
Atotech to present on five topics at productronica and SEMICON Europa 2017
Atotech will join and exhibit at productronica 2017, November 14 to 17, next week in Munich. For the first time, SEMICON Europa will be co-located with productronica ...
September 14, 2017
Atotech to present leading fan-out wafer-level packaging technology at SEMICON Taiwan
Atotech is amongst the leading metallization companies in the semiconductor industry, providing cutting-edge chemistry, equipment and process solutions for advanced ...
September 6, 2017
New Neoganth® X Activator from Atotech
A major cost driver for PCB manufacturers with horizontal plating lines is the palladium consumed within the activation step. Atotech developed a new activation system ...
August 29, 2017
Atotech presents study results of Pd initiation in ENEPIG at the InterPACK 2017
Atotech will present its latest know-how on Pd initiation in the ENEPIG process at this year's InterPACK 2017. On Wednesday, August 30, from 9:15 to 10:45 am ...
July 10, 2017
BondFilm® LDD MSAP -- Atotech's laser direct drilling pretreatment for advanced mSAP applications
Atotech introduces BondFilm® LDD and BondFilm® LDD Enhancer, its latest additions to the BondFilm® product family, the world's most successful, reliable and omnipresent ...
June 7, 2017
Atotech presents NovaBond® IT at the JPCA Show 2017
Atotech will introduce NovaBond® IT, its new and innovative non-etching adhesion promoter for IC Substrates and high frequency application inner-layer bonding ...
May 17, 2017
Atotech presents next generation technologies at ECTC 2017
Atotech will present its next generation plating technologies for FO-Panel Level Packaging (FO-PLP) at the upcoming ECTC 2017, held from May 30 to June 2, 2017, at the Walt Disney ...