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Press Releases

June 1, 2017  -  Click the title to read the full press release.

EV Group Expands Production Capacity at Corporate Headquarters in Austria
EV Group (EVG) announced that it is expanding production capacity at its corporate headquarters in St. Florian am Inn, Austria. Representing a 20 million Euro investment ...

EV Group
July 6, 2018
EV Group Accelerates 3D-IC Packaging Roadmap with Breakthrough Wafer Bonding Technology
EV Group (EVG) unveiled the new SmartView® NT3 aligner, which is available on the company's industry benchmark GEMINI® FB XT integrated fusion bonding system ...
June 25, 2018
EV Group Earns Sixth Triple Crown Win in VLSIresearch Customer Satisfaction Survey
EV Group announced that customers have once again voted the company one of the 10 BEST Focused Suppliers of Chip Making Equipment and one of the 2018 THE BEST Suppliers ...
May 17, 2018
EV Group Secures Lithography Order from VTT for 'More than Moore' Applications
EV Group (EVG) announced that it has received an order for its EVG®120 automated resist processing system from VTT Technical Research Centre of Finland (VTT). An ...
May 4, 2018
EV Group Begins Construction of New Manufacturing III Building to Expand Production Capacity
EV Group announced that it has started construction work for the next expansion phase of its corporate headquarters. The new, state-of-the-art building will house ...
May 2, 2018
WaveOptics Collaborates with EV Group to Drive Augmented Reality Manufacturing at Scale
WaveOptics announced a collaboration with EV Group to bring high-performance augmented reality (AR) waveguides to the mass market at the lowest cost available in the ...
March 19, 2018
EV Group and IBM Sign License Agreement on Laser Debonding Technology
EV Group and IBM announced that the companies agreed to sign a license agreement on laser debonding technology. EVG plans to integrate IBM's patented Hybrid Laser ...
February 13, 2018
VIEWPOINT 2018: Paul Lindner, Executive Technology Director, EV Group
While 2017 saw many significant developments in semiconductor advanced packaging, one in particular stood out - the increasing integration of optical sensors in consumer electronics. 3D sensing cameras have become a focus for creating more authentic virtual and augmented reality (VR/AR) user experiences ...
December 20, 2017
EV Group Complete Latest Phase of Production Capacity Expansion at Corporate Headquarters
EV Group announced that it has completed construction and opened a new building at its corporate headquarters in Austria to expand capacity for producing its ...
December 13, 2017
EV Group Installs Low-temperature Plasma Activation System at the University of Tokyo
EV Group (EVG) announced it has received an order from the University of Tokyo for its EVG810LT plasma activation system for compound semiconductor research. Installed ...
November 16, 2017
Leti Demonstrates 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System
EV Group (EVG) and Leti announced the world's first successful 300-mm wafer-to-wafer direct hybrid bonding with pitch dimension connections as small as 1µm (micron) ...