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Press Releases

May 17, 2017  -  Click the title to read the full press release.

Atotech presents next generation technologies at ECTC 2017
Atotech will present its next generation plating technologies for FO-Panel Level Packaging (FO-PLP) at the upcoming ECTC 2017, held from May 30 to June 2, 2017, at the Walt Disney ...

Atotech Deutschland GmbH
November 27, 2018
Atotech to present at the Electronics Packaging Technology Conference
Atotech will present at this year's Electronics Packaging Technology Conference (EPTC) held at the Resorts World Sentosa in Singapore from December 4 to 7, 2018. ...
November 13, 2018
Atotech product experts to present at SEMICON Europa and electronica 2018
Atotech Group will exhibit and present its latest products for power, automotive, and mobile semiconductor applications at this year's SEMICON Europa. Atotech's ...
October 9, 2018
Reducing manufacturing costs on Fan-Out Panel-Level Packaging
"Upscaling panel size for copper plating on FO-PLP applications to reduce manufacturing cost" will be the topic of Atotech's presentation at this year's iMAPS ...
September 7, 2018
The next revolution in electroless copper for advanced FPCB is now available
Atotech introduces a new horizontal electroless copper process specifically developed to ensure a blister-free electroless copper deposition and shiny surface ...
September 5, 2018
Atotech to exhibit and present at the SEMICON Taiwan
Atotech announced its participation at this year's SEMICON Taiwan Show, held from September 5 to 7, 2018, in the Taipei Nangang Exhibition Center Hall 1 in Taipei, Taiwan ...
May 22, 2018
Atotech to present Spherolyte® CU UF3 for fine line RDL at ECTC 2018
Atotech is pleased to announce its partaking in the Electronics Components and Technology Conference (ECTC) 2018. As a gold sponsor, Atotech will participate with two ...
April 30, 2018
BondFilm® HF -- Atotech's new horizontal bonding enhancement solution
BondFilm® HF is Atotech's new process for the treatment of inner layer cores. It leads to highest bonding performance in the manufacture of multilayer & HDI ...
March 15, 2018
Atotech presents new solutions for (a)mSAP applications at CPCA 2018
Atotech confirmed to showcase its latest solutions for (a)mSAP application at the upcoming CPCA show in Shanghai, China, from March 20 through 22, 2018. The company has developed ...
March 12, 2018
Atotech to present MultiPlate® for Power IC at SEMICON China 2018
Atotech announced that it will present and exhibit at Semicon China 2018 to be held in Shanghai from March 14 to 16, 2018. On Friday, March 16, from 11:30 to 11:45 am ...
March 6, 2018
Atotech's MultiPlate® for FOPLP at IMAPS Device Packaging Conference
At the upcoming IMAPS Device Packaging Conference 2018, Atotech will speak about the move from Fan Out Wafer Level Packaging (FOWLP) to Fan Out Panel Level Packaging ...