Press Release - StratEdge Corporation
May 5, 2017  -  Click the title to read the full press release.

StratEdge Semiconductor Packages Now Sold on Amazon.com



StratEdge Corporation announces the opening of its Amazon Store to sell its off-the-shelf high-frequency packages. "It is a relatively new concept to use Amazon ...

StratEdge Corporation
March 12, 2024
StratEdge Brings Packaging Innovation to IMAPS Device Packaging
StratEdge Corporation announced it will showcase its latest package manufacturing innovations at the IMAPS Device Packaging Conference in Fountain Hills, Arizona ...
March 1, 2024
Package and Die Attach Material Comparisons for High Power GaN Devices
Explore the vital role of packaging GaN devices! This study compares CuW and CMC bases with H20E and AuSn, revealing 34.5°C cooler junctions with CMC/AuSn.
February 20, 2024
No Redesign Required: StratEdge Revives Critical Hybrid Packages
StratEdge Corporation announces its capabilities for making hybrid packages used in legacy applications where redesigns are difficult or impossible. These hybrid packages ...
January 11, 2024
VIEWPOINT 2024: Casey Krawiec, VP of Global Sales, StratEdge Corporation
December 5, 2023
StratEdge Presents and Exhibits at ASME InterPACK 2023
StratEdge Corporation proudly announces its latest presentation, "Package and Die Attach Materials for High-Power GaN Devices," which was presented at InterPACK 2023 ...
September 19, 2023
StratEdge Reveals Semiconductor Packages at European Microwave Week, IMAPS, and IEEE BCICTS
StratEdge Corporation will present its thermally-efficient line of post-fired and molded ceramic semiconductor packages at several upcoming events including European ...
August 25, 2023
StratEdge Presents Hermetic Molded Ceramic Packages at European Microwave Week
StratEdge Corporation is set to showcase its off-the-shelf line of molded ceramic packages at European Microwave Week (EuMW), September 19-21. These StratEdge molded ...
June 20, 2023
StratEdge Semiconductor Packages at IMS: Powering the Future of Technology
StratEdge Corporation will showcase its thermally-efficient line of post-fired and molded ceramic ...
April 19, 2023
StratEdge Pushes High-Temperature Packaging Technology to the Extreme at Upcoming Events
StratEdge Corporation is set to showcase its latest packaging technology for high-temperature applications at several industry conferences in April and May. The events ...
March 15, 2023
StratEdge to Display Molded Ceramic Semiconductor Packages at March Conferences
StratEdge Corporation will display its molded ceramic packages at the IMAPS Device Packaging, APEC, and GOMACTech conferences, all of which are being held in March. ...
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