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Press Releases

April 27, 2017  -  Click the title to read the full press release.

Two Part, Low Viscosity Epoxy Offers Long Working Life and High Elongation
Master Bond EP29LPHE is a two component epoxy system with a low mixed viscosity of 350-700 cps. This low shrinkage/low exotherm product is particularly well suited for large ...

Master Bond
June 7, 2018
Toughened Two Part Epoxy Withstands Repeated Thermal Cycling
Master Bond Inc. has developed a solvent free, two component, toughened epoxy system called Supreme 62-1. It is serviceable from -60°F to +450°F (-51°C to +232°C). Most ..
May 16, 2018
One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was developed for crucial thermal management applications. As a one component system, it is not premixed ...
April 4, 2018
Ultra Low Viscosity Biocompatible Epoxy for Medical Electronic Applications
Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a mixed viscosity of 150-300 cps. Its ultra low viscosity...
February 23, 2018
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity
Master Bond MasterSil 170 Gel is a two component system with excellent flowability for potting and encapsulation applications. It possesses a low mixed viscosity ...
February 2, 2018
Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion
Master Bond EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting ...
January 11, 2018
Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile
Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. This thixotropic, moderately low viscosity compound ...
December 13, 2017
Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500°F
Master Bond Supreme 34CA is a high strength structural epoxy adhesive featuring superior resistance to aggressive chemicals such as acids, bases, solvents and oils ...
November 1, 2017
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity
Master Bond EP3HTSDA-1 is a single part, no mix epoxy adhesive designed primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f ...
August 9, 2017
One Component Elastomeric Primer/Adhesive System Meets ISO 10993-5 Specs
Developed for priming and bonding polyolefinic substrates, Master Bond X21Med is a single component elastomeric compound that passes ISO 10993-5 tests for cytotoxicity. ...
July 20, 2017
Thermally Conductive, Electrically Insulative Epoxy Delivers Low Exotherm
Master Bond EP39MAOHT is a room temperature curing system for demanding bonding, sealing, coating, potting and encapsulation applications. "It is a versatile product ...