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April 18, 2017  -  Click the title to read the full press release.

TechSearch International Analyzes High-Performance Package Trends
A variety of alternatives are challenging silicon's role in advanced packaging interposers for highperformance applications. The first applications using silicon interposers ...

TechSearch International
April 18, 2017
TechSearch International Analyzes High-Performance Package Trends
A variety of alternatives are challenging silicon's role in advanced packaging interposers for highperformance applications. The first applications using silicon interposers ...
January 24, 2017
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP
TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fanout WLP (FO-WLP). Driven by demand for thin, low-profile packages ...
January 20, 2017
TechSearch International Analysis Predicts Growth for Fan-in and FO-WLP
TechSearch International predicts strong market growth for fan-in wafer level packages (WLPs) and fanout WLP (FO-WLP). Driven by demand for thin, low-profile ...
October 28, 2016
TechSearch International Analysis Shows CSP Growth Remains Strong
Despite a slowing growth rate for smartphones, the industry is experiencing strong growth for CSP packages such as QFNs and stacked die CSPs. TechSearch International's ...
July 28, 2016
Wearables Packages Enabled by Advances in Assembly and Packaging
Strong market growth is predicted for wearable electronics fueled by new generations of wearables providing greater functionality in the same or smaller form factor, for the same ...
March 9, 2016
Miniaturization Trends Drive Growth in SiP Market
With the proliferation of mobile electronic products and the ongoing push for greater functionality in a smaller area, miniaturization has become a key word for system-in-package ...
August 21, 2015
TechSearch International Analyzes CSP Market Growth
Driven by use in mobile products such as smartphones, CSPs continue to show growth. TechSearch International's latest CSP market forecast shows ...
June 5, 2015
TechSearch International Makes Sense of Package Alphabet Soup
With new packages continuously being introduced, TechSearch International's latest Advanced Packaging Update focuses on making some sense out of the alphabet ...
March 20, 2015
TechSearch International Analyzes Flip Chip and Wafer Level Package Growth
Shipments of flip chip and wafer level packages (WLPs) continue to increase. TechSearch International's new study, 2015 Flip Chip and WLP: Emerging Trends ...
September 15, 2014
3D IC Gap Analysis: Remaining Issues, Solutions, Market Status
TechSearch International Study Details Market Growth for 3D ICs and 2.5D Interposers Major DRAM makers Micron, SK Hynix, and Samsung have announced ...