We search for industry news, so you don't need to.
News | Search | Subscribe
Press Releases

March 21, 2017  -  Click the title to read the full press release.

STATS ChipPAC Achieves 1.5 Billion Unit Milestone in Fan-out Wafer Level Packaging Shipments
STATS ChipPAC Pte. Ltd. announced that it has shipped 1.5 billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer Level Ball Grid ...

STATS ChipPAC
March 21, 2017
STATS ChipPAC Achieves 1.5 Billion Unit Milestone in Fan-out Wafer Level Packaging Shipments
STATS ChipPAC Pte. Ltd. announced that it has shipped 1.5 billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer Level Ball Grid ...
May 16, 2016
STATS ChipPAC's Fan-out Wafer Level Packaging Shipments Exceed 1 Billion Units
STATS ChipPAC Pte. Ltd. announced that it has shipped over one billion fan-out wafer level packages (FOWLP), also known in the industry as embedded Wafer ...
January 20, 2016
STATS ChipPAC Ranked in Top 10 Semiconductor Equipment Manufacturing Companies
STATS ChipPAC Ltd. announced that it has been ranked among the world's top 10 semiconductor equipment manufacturing companies in the 2015 Patent Power ...