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Press Releases

March 16, 2017  -  Click the title to read the full press release.

Supreme 3HTND-2DM: One Part, Toughened Epoxy
Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. Essentially, there are two ...

Master Bond
August 9, 2017
One Component Elastomeric Primer/Adhesive System Meets ISO 10993-5 Specs
Developed for priming and bonding polyolefinic substrates, Master Bond X21Med is a single component elastomeric compound that passes ISO 10993-5 tests for cytotoxicity. ...
July 20, 2017
Thermally Conductive, Electrically Insulative Epoxy Delivers Low Exotherm
Master Bond EP39MAOHT is a room temperature curing system for demanding bonding, sealing, coating, potting and encapsulation applications. "It is a versatile product ...
July 5, 2017
Master Bond EP41S-F - Rapid Curing Two Component Epoxy
Master Bond EP41S-F is a two part epoxy for bonding, sealing, coating and encapsulation applications. It combines fast ambient temperature cure speed with chemical resistance ...
June 8, 2017
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions
Formulated to meet rigorous Airbus specifications, Master Bond EP93FRHT passes the twelve second vertical burn test per AITM 2.0002B and Section 7.1.2 of ABD0031, Issue F ...
May 18, 2017
Two Component, Low Viscosity Epoxy Features Outstanding Chemical Resistance
Master Bond EP62-1BF is a two part epoxy featuring the ability to withstand exposure to aggressive chemicals including acids, bases and solvents, even at high temperatures. ...
April 27, 2017
Two Part, Low Viscosity Epoxy Offers Long Working Life and High Elongation
Master Bond EP29LPHE is a two component epoxy system with a low mixed viscosity of 350-700 cps. This low shrinkage/low exotherm product is particularly well suited for large ...
April 13, 2017
Master Bond Introduces MasterSil 157
Ideal for potting and encapsulation applications, MasterSil 157 is a two component silicone system that features low viscosity and low exotherm. It has superior electrical ...
March 16, 2017
Supreme 3HTND-2DM: One Part, Toughened Epoxy
Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. Essentially, there are two ...
February 1, 2017
Master Bond Room Temperature Curing Epoxy Features Low Thermal Resistance
Formulated for use in demanding thermal management applications, Master Bond EP30TC is a two component epoxy that contains a robust thermally conductive filler ...
January 10, 2017
Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations
Master Bond EP3HTND-2Med Black is a high strength, fast curing epoxy for use in the assembly of medical devices. It fully meets USP Class VI specifications. This ...