We search for industry news, so you don't need to.
News | Search | Subscribe
Press Releases

March 16, 2017  -  Click the title to read the full press release.

Supreme 3HTND-2DM: One Part, Toughened Epoxy
Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. Essentially, there are two ...

Master Bond
June 8, 2017
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions
Formulated to meet rigorous Airbus specifications, Master Bond EP93FRHT passes the twelve second vertical burn test per AITM 2.0002B and Section 7.1.2 of ABD0031, Issue F ...
May 18, 2017
Two Component, Low Viscosity Epoxy Features Outstanding Chemical Resistance
Master Bond EP62-1BF is a two part epoxy featuring the ability to withstand exposure to aggressive chemicals including acids, bases and solvents, even at high temperatures. ...
April 27, 2017
Two Part, Low Viscosity Epoxy Offers Long Working Life and High Elongation
Master Bond EP29LPHE is a two component epoxy system with a low mixed viscosity of 350-700 cps. This low shrinkage/low exotherm product is particularly well suited for large ...
April 13, 2017
Master Bond Introduces MasterSil 157
Ideal for potting and encapsulation applications, MasterSil 157 is a two component silicone system that features low viscosity and low exotherm. It has superior electrical ...
March 16, 2017
Supreme 3HTND-2DM: One Part, Toughened Epoxy
Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. Essentially, there are two ...
February 1, 2017
Master Bond Room Temperature Curing Epoxy Features Low Thermal Resistance
Formulated for use in demanding thermal management applications, Master Bond EP30TC is a two component epoxy that contains a robust thermally conductive filler ...
January 10, 2017
Biocompatible, Non-Drip Epoxy Resists Repeated Sterilizations
Master Bond EP3HTND-2Med Black is a high strength, fast curing epoxy for use in the assembly of medical devices. It fully meets USP Class VI specifications. This ...
December 14, 2016
Thermally Conductive, High Temp Resistant Epoxy Passes NASA Low Outgassing Tests
Certified to meet ASTM E595 NASA low outgassing standards, Master Bond EP46HT-2AO Black is well suited for the aerospace, electronic, opto-electronic industries ...
November 23, 2016
One Component Elastomeric System Features Excellent Thermal Conductivity
Master Bond X5TC is an elastomeric system that has a thermal conductivity of 10-12 BTU•in/ft2•hr•°F [1.44-1.73 W/m•K] while maintaining solid electrical insulation ...
November 4, 2016
Master Bond Chemical Resistant, Two Part Epoxy Features Glass Transition Temp
Widely used in the electronic, aerospace, optical and specialty OEM industries, Master Bond EP126 excels in high temperature applications up to +600°F ...