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March 16, 2017

Holland Venture invests in semiconductor packaging equipment specialist Boschman Group

Amsterdam/Duiven -- Holland Venture, a Dutch based investment firm, announced today that it completed an investment in the Boschman Group, a specialist in high-end packaging equipment for the semiconductor industry. This investment enables the Boschman Group to further commercialize their in-house developed technology and strengthen their international market position.

'We see with the advance of the Internet of Things an increase of complexity in products, specifically with regard to the number of innovative sensors integrated in one device, like in smartphones for instance. Also electrical and autonomous vehicles will demand increasingly more sensors with a higher level of integration and high quality requirements as well as efficient and robust power electronics. Exactly in these type of applications the Boschman Group has a strong market position and with their patented technology they are perfectly positioned to meet the growing and ever more complex demands in these segments over the coming years. Several projects with important companies such as Semikron, Bosch, Renesas and Infineon are ongoing. A leading American manufacturer of electric vehicles (EVs) is already using Boschman Technology, which enables them to develop highly efficient power electronics in a small form factor to be used in their latest car design', said Hubert Verbeek, Managing partner in Holland Venture.

Frank Boschman, CEO of the Boschman Group, indicates that he sees Holland Venture as their ideal partner who can support them in their ambition for continuous international growth. 'We are ready for the next step to further improve our value proposition, service and continuity. We will utilize the investment from Holland Venture additionally to strengthen our sales, invest in production capabilities and increase our innovation efforts in leading packaging technologies'.

Advanced Packaging Center

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