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Press Releases

March 15, 2017  -  Click the title to read the full press release.

SUSS MicroTec Launches XBS200 - A New Automated Permanent Wafer Bonding System
SUSS MicroTec launched a brand-new automated permanent wafer bonding system today. The XBS200 is a universal platform, designed for aligned wafer bonding of wafer sizes ...

SUSS Microtec
March 15, 2017
SUSS MicroTec Launches XBS200 - A New Automated Permanent Wafer Bonding System
SUSS MicroTec launched a brand-new automated permanent wafer bonding system today. The XBS200 is a universal platform, designed for aligned wafer bonding of wafer sizes ...
November 29, 2016
SUSS MicroTec Announces Strategic Alliance with Kanematsu PWS LTD. in Japan
SUSS MicroTec announces a strategic reseller partnership with Kanematsu PWS LTD., Yokohama, a subsidiary of Kanematsu Corporation, Tokyo. Under the terms ...
September 7, 2016
SUSS MicroTec Launches Coat and Develop Solution for Advanced Packaging Applications
SUSS MicroTec announced the launch of its new generation of the fully automated ACS300 platform. The modular system of the ACS300 Gen3 is specifically designed for ...
September 1, 2016
Supervisory Board Appoints Dr. Franz Richter as new President and CEO of SUSS MicroTec
The Supervisory Board of SUSS MicroTec AG has appointed Dr. Franz Richter (61) as a new member of the management board of SUSS MicroTec AG. His contract will run ...
July 5, 2016
SUSS MicroTec announces new Mask Aligner series MA/BA Gen4
SUSS MicroTec announced the launch of the MA/BA Gen4 series today. The new generation of SUSS MicroTec's semi-automated Mask and Bond Aligners extends its ...
May 23, 2016
SUSS MicroTec: New Surface Laser Imaging Technology
SUSS MicroTec has launched the LI Series -- a new Surface Laser Imaging platform as pre-announced on May 4, 2016. The highly versatile technology of the LI ...
September 28, 2015
SUSS MicroTec Receives Large Volume Order for Lithography Projection Scanners
SUSS MicroTec has received an order for multiple SUSS MicroTec Photonic Systems lithography tools in Q3 2015 from a leading semiconductor manufacturer. The ...
September 21, 2015
XB8 - New Semi-Automated High-Force Wafer Bonder
SUSS MicroTec has launched the new bonding platform XB8 today. The XB8 wafer bonder is designed for a wide range of bonding processes. It supports substrates ...
August 20, 2015
New Competence-Center for Nanoimprint in North America
SUSS MicroTec and the Singh Center for Nanotechnology at the University of Pennsylvania (Penn) are announcing a cooperation agreement in the field ...
June 25, 2015
SUSS MicroTec and Georgia Institute of Technology Establish Partnership
SUSS MicroTec and the Georgia Institute of Technology announced a collaboration for nanotechnology, bio-medical and semiconductor 3D packaging research. As ...